Inline X-Ray Inspection of BGA Solder Joints

10 March 2011 - GOEPEL electronic’s 3D x-ray inspection system OptiCon X-Line 3D enables a safe quality control of BGA solder joints in the inline production process of single-sided and double-sided equipped PCBs within one test run. After image capturing from different directions and succeeding reconstruction, OptiCon X-Line 3D provides the opportunity to analyse board top and bottom sides layer by layer.

Initially, each BGA solder ball is localised in x/y-direction as well as z-direction. Subsequently, relevant parameters of each solder joint are determined in three layers. By comparing these measuring values open solder joints and wetting defects can de safely detected. Additionally, voids can be determined in size and their z-position within a solder joint. Naturally, the system is able to detect solder connections at IC pins and 2-pin components as well as THT components.

The OptiCon X-Line 3D is unrivalled worldwide by utilising the revolutionary GigaPixel technology. A real-time multi angle image recording is the basis that enables a test speed of 40cm²/s at full 3D PCB capturing. Integrated reconstruction methods, based on digital tomosynthesis, allows defined evaluation of the board’s single layers.