High-performance 3D Void Inspection with inline X-Ray System

20 April 2011 - GOEPEL electronics’ inline x-ray inspection system OptiCon X-Line 3D provides the powerful opportunity to detect voids with in various layers of large volume solder joints.  In particular in the areas of power electronics for wind power, solar electricity or electro mobility the solder quality is highly important for the components’ thermal coupling, as high reliability and long service life must be guaranteed by maximum heat dissipation.

To ensure the above requirements are meet, the 3D x-ray inspection system OptiCon X-Line 3D was enhanced to enable an adapted image recording as well as the reconstruction layer-by-layer. The recorded images allow for an automatic detection of voids in each layer including classification in terms of quality parameters, separately defined for the respective layer. Furthermore, there is the opportunity to survey and evaluate faults by means of the reconstructed images at a subsequent verification station.

Additionally, the AXI system OptiCon X-Line 3D sits comfortably in the inline inspection of double-sided Printed Circuit Boards (PCB). In just one run all PCB layer information is available and can be individually reconstructed for automatic analyses. This characteristic provides the opportunity to break down critical solder joints (e.g. under BGAs) into single layers for detailed automatic analysis.