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Automated Inspection of Bonding Pads

06 May 2011 - GOEPEL electronics’ OptiCon AOI systems can now be utilised for automated inspection of bonding pads for solder splashes, deformations and any other impurities in the micrometer range. Meeting these test tasks, an additional camera module with a resolution of 3 µm is available in the AOI systems. An adaptive illumination system and particularly developed inspection functions enable highest fault detection at extremely low false-call rate.

The high-resolution camera system can be utilised parallel to the test modules for component and solder joint inspection in the stand-alone and inline OptiCon systems. That enables an effective inspection of both soldered components and bonding pads in one production run.

GOEPEL electronics’ OptiCon AOI systems, offered in various configuration versions, can be utilised in different PCB production areas, e.g. before or after the soldering process, as stand-alone and inline machines. The AOI systems are able to detect manufacturing faults, such as faulty solder joints and components as well as multi-pin or misplaced components. The OptiCon series systems were honoured with several industry awards, e.g. the “Best in Test Award” for OptiCon BasicLine and OptiCon TurboLine.

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