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AOI System for IC Substrate and Advanced HDI Production

22 May 2012 - Orbotech Ltd announced its new Ultra Fusion 200 automated optical inspection (AOI) system.  The newest model in the Company’s flagship Fusion AOI product line, Ultra Fusion 200 delivers leading-edge performance for IC substrate and advanced HDI production down to 15μm with high throughput.

“As the PCB industry continues to push the boundaries of complexity and performance, our customers require innovative digital tools that enable new production capabilities. At the same time, they must continue to reach the quality and efficiency levels necessary to maintain profitability”, Mr. Richard Klapholz, President of the PCB Division at Orbotech Ltd. “As an integral component in our vision for creating a new PCB world, Ultra Fusion 200 delivers the highest detection results without compromising on throughput. This results in the lowest cost-per-scan for IC substrate and advanced HDI inspection and ensures significantly higher production yields.”

Featuring powerful Multi-Image Technology, Ultra Fusion 200 achieves a major reduction in false alarms of up to 70% compared to conventional AOI results. Unlike traditional, gray-scale AOI, Fusion systems perform inspection using different lights and from different angles revealing details that are unseen by other systems. Ultra Fusion utilizes an innovative optical head specially designed to accommodate the specific requirements of semi-additive processes (SAP/mSAP) and any-layer structures. A patented vacuum table supports a wide variety of materials for maximum inspection flexibility. With online verification capabilities built into the system, Ultra Fusion 200 provides fast and easy access to the defect area, reducing handling damage and scrap. The system’s Smart Setup operation transforms the traditional AOI setup process – from a trial-and-error one to a single smooth cycle with minimal process steps.

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