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Orbotech expands Ultra Fusion AOI Series

29 June 2012 – Orbotech announced that it has expanded its Ultra Fusion series of automated optical inspection (AOI) systems. The new Ultra Fusion 300 is designed to support the production of advanced IC substrates down to 10μm. In addition to Ultra Fusion 300, the Company also offers the recently launched Ultra Fusion 200 for IC substrate and advanced HDI production down to 15μm.

Mr. Richard Klapholz, President of the PCB Division at Orbotech Ltd., said: “With Ultra Fusion 300, we are extending the benefits of our latest Fusion platform and its innovative Multi-Image Technology to support the challenging production of the industry’s most complex IC substrates.“

Featuring powerful Multi-Image Technology, Ultra Fusion achieves a major reduction in false alarms of up to 70% compared to conventional AOI results. Unlike traditional, gray-scale AOI, inspection is performed using different lights and from different angles revealing details that are unseen by other systems. Ultra Fusion utilizes an innovative optical head specially designed to accommodate the specific requirements of semi-additive processes (SAP/mSAP). A patented vacuum table supports a wide variety of materials for maximum inspection flexibility. With online verification capabilities built into the system, Ultra Fusion provides fast and easy access to the defect area, reducing handling damage and scrap. The system’s Smart Setup operation transforms the traditional AOI setup process – from a trial-and-error one to a single smooth cycle with minimal process steps.

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