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Advantest to showcase Cloud Testing Platform at SEMICON Europa 2013

08 October 2013 - Advantest Corporation will showcase its suite of semiconductor solutions, ranging from nanotechnology electron beam (EB) lithography to automatic test equipment and cloud testing services at the SEMICON Europa 2013 trade show, stand #1.207, Hall 1, October 8-10 in Dresden, Germany.

Advantest will highlight an industry-first cloud testing solution ideal for semiconductor design, electronic component R&D, prototype evaluation, failure analysis and academic research. The company will also display next-generation nanotechnology EB lithography for nano-patterning and defect review as well as its multi-vision 3D metrology technologies. 

“For the first time at SEMICON Europa, Advantest will have dedicated displays for its nanotech and cloud testing technologies,” said Josef Schraetzenstaller, managing director and CEO of Advantest Europe. “These new additions align with the company’s strategic, proactive expansion into new markets, while continuing to invest in ATE solutions.”

In collaboration with the SEMICON Europa trade show, Advantest will present a number of technical papers on its cloud testing services, 3D metrology, MEMs, automotive and test leadership at EMTC and the Tech Arena:

EMTC, Tuesday, October 8

  • 13:35: “Automotive Single Insertion Multi-Temperature KGD Test Solution,” by Gary Fleeman
  • 15:10: “An Introduction to CloudTestingTM, Making Chip Test Available for Everyone,” by Manabu Kimura
  • 16:30: Panel Discussion: “Is Test Becoming a Commodity?” with Michael Stichlmair

EMTC, Wednesday, October 9

  • 11:00: Panel Discussion: “How Do We Leverage EU Leadership in MEMS Test into Other Areas?” with Adriano Mancosu

TechArena, Wednesday, October 9

  • 13:15: “An Introduction to CloudTestingTM, Making Chip Test Available to Everyone,” by Manabu Kimura

TechArena, Thursday, October 10

  • 14:00: “Introduction of Novel 3D Metrology Tool for Leading Edge Devices,” by Kazuhiro Arakawa.

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