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Direct-ProbeTM Solution for Verigy V93000

02 July 2010 - Verigy has extended the scalability of its production-proven V93000 platform by adding the Direct-Probe™ solution. This high-performance probe test capability for digital, mixed-signal and wireless communication ICs delivers one of the highest signal integrity levels available for production-volume, multi-site probe testing.

The innovative new Direct-Probe RF solution reduces the cost of test for radio-frequency (RF), high-pin-count digital and complex mixed-signal devices, addressing the global semiconductor market's rapid shift to performance probe test and wafer-level chip scale packages (WLCSP). By removing the conventional mechanical interface between the wafer and tester, Verigy's V93000 platform equipped with the Direct-Probe RF solution reduces the length and number of signal-path connections, significantly improving signal integrity for RF device testing.

The V93000 with Direct-Probe RF solution can be designed to use a single-load board for both wafer probe and final test. This reduces the time between IC development and production, minimizes the correlation effort between probe and final test, and enables high multi-site capability. Verigy’s Direct-Probe RF capability also provides the largest component area for application use while maintaining planarity of +1 mm over a 44,000-square-millimeter area.

In addition, V93000 Direct-Probe solutions offer full platform compatibility with all tester configurations while the V93000’s scalable architecture provides the versatility to test the full spectrum of RF-based semiconductor devices.

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