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CyberOptics to acquire 3D Metrology Company27 January 2013 - CyberOptics announced it has entered into a definitive agreement to acquire the assets of Laser Design, Inc. (LDI), a 3D metrology company headquartered in Minneapolis. The approximately $3.0 million all-cash transaction is expected to close in February 2014, pending approval by LDI’s shareholders. LDI, which will be operated initially as a wholly-owned subsidiary, is forecasted to have a minimal impact on CyberOptics’ consolidated bottom line performance in 2014. JDSU enhances Base Station Analyzer27 January 2013 - The CellAdvisor JD780A Base Station Analyzer Series of JDSU now supports LTE-Advanced, analyzing up to five component carriers and MIMO with two or four transmitting branches. Also new is PIM detection, and users can now control the instrument wirelessly up to 328 ft (100 m) via Bluetooth. These advanced capabilities let users keep pace as LTE evolves, and allow the safe testing of high-mounted remote radio units from the ground. Tektronix delivers expanded MIPI M-PHY Receiver Test Solution24 January 2014 – Tektronix announced expanded capabilities for its M-PHY Receiver test solution. The additional capabilities include physical layer receiver testing for High Speed Gear2 and Gear3, support for PWM Mode (G0-G7), auto-calibration and margin testing. Support for HS Gear2 and Gear3 and PWM Mode (G0-G7) gives designers the flexibility to perform tests at the full range of data rates for comprehensive insights into their designs. GNSS Simulator supports also Chinese BeiDou Standard24 January 2013 — Rohde & Schwarz extends the functionality of the R&S SMBV100A vector signal generator by adding BeiDou/Compass capability to its integrated GNSS (Global Navigation Satellite System) simulator. With the R&S SMBV-K107 option the GNSS simulator now covers the BeiDou standard as well as the GPS, Galileo and Glonass satellite navigation systems. Fast Design-to-Automated Inspection Data Flow23 January 2013 - CyberOptics announces the close-to-immediate setup of PCBA inspection using Automated Optical Inspection (AOI) and Solder Paste Inspection (SPI) systems for new products in just one simple step. Programming automated inspection systems has been a long-standing bottleneck for the acceleration of the new product introduction (NPI) process; a barrier now removed using the Mentor Valor Process Preparation programing tool in conjunction with CyberOptics inspection systems. Nordson DAGE launches Wafer X-ray Metrology Platform23 January 2014 - Nordson DAGE announces the launch of its XM8000 Wafer X-ray Metrology Platform at the SEMI European 3D TSV Summit taking place in Grenoble, France 20-22 January 2014. This new platform takes the capabilities from Nordson DAGE’s existing X-ray systems to provide an automated, high-throughput X-ray metrology and defect review system for both optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps. Development, Test and Debug Environment for Freescale and STMicroelectronics Microcontrollers22 January 2014 – The Universal Emulation Configurator (UEC) from PLS Programmierbare Logik & Systeme is now also available for the emulation devices MPC57xx from Freescale and SPC57x from STMicroelectronics. With the help of this special tool for definition of trace and measurement tasks for on-chip emulation logic, the full potential of the emulation devices can be used for the first time without any limitations for troubleshooting and software quality assurance. More Articles ...
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