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News - Board and System TestPCI Express 6.0 and CXL Interposer24 February 2023 – Teledyne LeCroy announced availability of their PCI Express (PCIe) 6.0 CEM x16 interposer for probing systems and devices that use the latest PCIe 6.0 and CXL specifications. This new interposer takes advantage of Teledyne LeCroy’s TAP6 technology and will benefit the development and test community by reducing signal integrity issues as they push the limits of the specification where signal loss budgets become crucial. Anritsu and Spirent Communications collaborate on Open RAN Test Solutions21 February 2023 – Anritsu has announced a strategic partnership with Spirent Communications in Open RAN test solutions. This collaboration will play a key role in helping equipment vendors, carriers, system integrators, cloud service providers, and others to configure an Open RAN ecosystem by measuring wireless RAN O-RU characteristics, fronthaul Conformance Tests and End-to-End tests connecting O-DU, O-CU, and Core. The Open RAN is the concept specifying open standards for network interfaces to expand services and reduce costs by supporting multivendor equipment sourcing as well as to enable intelligence, helping drive growth and creating new business opportunities. Mobile network operators and equipment vendors are testing and introducing Open RAN led by the O-RAN ALLIANCE and other promotion groups. Open Compute Project (OCP) v2.0 SSD Validation Testing20 February 2023 – Teledyne LeCroy announced compliance testing support for the second generation of the OCP Datacenter NVMe SSD Specification (v2.0) within the OakGate SSD test platform and from Austin Labs testing services. OCP v2.0 builds on OCP v1.0a adding new and enhanced validation testing requirements. And LeCroy’s new OCP v2.0 compliance software suite provides an unprecedented level of functionality, performance, and ease of use for testing enterprise-level storage devices. Simplified Authentication for Battery Pack Testing17 February 2023 - The most significant difference between electric vehicle technology and the gas-diesel technology of the past is the battery system developed for each different vehicle model. To minimize security threats such as leakage of critical information, tampering with BMS (Battery Management System) data, and charging attempts using counterfeit chargers, manufacturers set up different authentication levels for diagnostic readings and control of information. New Sales Partnership for the Polish Market16 February 2023 – With PB Technik Sp. z o.o. coming onboard, Viscom AG has gained a new strong distribution partner for Poland. The contract was signed on February 1, 2023 and covers Viscom's entire portfolio of inspection systems for electronics manufacturing. PB Technik is based in Warsaw, the capital of Poland. Founded in 1991, the company now represents many manufacturers known in the industry for equipping modern assembly lines and has over 40 employees, including its own service specialists. PCI Express 6.0 Electrical Testing15 February 2023 – Teledyne LeCroy announced support for PCI Express 6.0 electrical test and validation with QPHY-PCIE6-TX-RX fully automated test software, as well as SDAIII-PCIE6 and SDAIII-PAMx characterization and debug software packages. The growth of new technologies, including artificial intelligence/machine learning (AI/ML) and high-performance computing (HPC), are accelerating demand for fast access to large amounts of data. To support this growing demand, the next generation of PCI Express, PCIe 6.0 technology, will use multi-level signaling (PAM4) to double data transfer speeds from the 32 GT/s transfer speed provided by PCIe 5.0 technology. Debugging of High-end SoCs10. February 2023 - With its current version 2023 of the Universal Debug Engine (UDE), PLS Programmierbare Logik & Systeme offers system developers a whole range of completely new and further optimized functions for debugging and especially for runtime analysis of embedded software. The portfolio of supported high-end microcontrollers has also been greatly expanded. PLS will present UDE 2023 for the first time at embedded world 2023 in Nuremberg in Hall 4, Booth 4-310. More Articles ...
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