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Readers Top 5 News of last 30 days
News - Board and System TestAPIX2 Physical Layer Testing for High-Resolution In-Car Video Applications08 October 2015 – Keysight Technologies announced that its new APIX2 compliance application offers the capability to characterize and test APIX2 (Automotive Pixel Link) high-speed SerDes (serialiser/deserialiser) technology using the Keysight Infiniium Series oscilloscopes. Developed by Inova Semiconductors, APIX2 is a multi-channel technology for high-resolution in-car video applications. APIX2 can establish multiple display links with a bandwidth of up to 3Gbps, over two pairs of copper cables or a single QSTP cable, and supports HD video at 24 bit color depth. Data Mining Tool streamlines Validation of Serdes High-Speed I/O Buses08 October 2015 – With HSIO Validation Assistant (HVA) ASSET InterTech introduced a new data mining tool for its ScanWorks platform. It automatically analyzes a database of signal integrity test data and quantifies the risk associated with potential design flaws or poorly performing devices on a system’s high-speed input/output (HSIO) buses. Faster 3D X-Ray Inspection06. October 2015 - The inline AXI system from GOEPEL electronics now offers an even faster high-end 3D inspection of complex assemblies. The “X40 PLUS” upgrade enables an X-ray inspection speed increase of up to 18 percent. Optimization the imaging chain in combination with an improved axle system and faster execution of the test algorithms results in significant savings of cycle time depending on the maximum resolution and the board dimensions. Tektronix expands Oscilloscope Family with new 50 GHz Model01 October 2015 - Tektronix announced the expansion of its DPO70000SX Performance Oscilloscope Series with 50 GHz and 23 GHz models. The new 50 GHz product is ideal for technologies such as 28 GBaud PAM4 and Kband frequency testing. The 23 GHz instrument joins the existing 33GHz models which feature compact dimensions and built-in scalability using the UltraSync synchronization technology. Boundary Scan Integration for SPEA 3030 ICT system23 September 2015 - GOEPEL electronics announces the availability of Boundary Scan integration into SPEA’s multi-core ICT (In-Circuit-Test) platform. With the level of integration provided for the SPEA3030 ICT, execution of interactive Boundary Scan tests is now possible on all cores of the ICT (up to four). This results in maximization of parallelism and productivity. Debugging and Testing Solution for STMicroelectronics new SPC58 E-line22 September 2015 – PLS Programmierbare Logik & Systeme offers a debugging and testing solution for the first samples of STMicroelectronics new SPC58 E-line in ST’s multi-core automotive microcontroller (MCU) family. The new SPC58 E-line MCUs are among the most sophisticated automotive MCUs currently available on the market. Nordson Corporation acquired MatriX Technologies18 September 2015 - Nordson Corporation announced it has acquired Germany-based Matrix Technologies, a manufacturer of automated X-ray inspection (AXI) equipment used to ensure the quality of electronic printed circuit boards, critical electronic devices and fully assembled products in consumer, automotive and other industrial end markets worldwide. More Articles ...
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