News - Board and System Test

Boundary Scan Support throughout the entire Product Life Cycle

25 March 2011 - GOEPEL electronic introduces the support of multi protocol interface chips from the British company Future Technology Devices International (FTDI) for their utilisation as native Boundary Scan controllers. The single-chip solutions with USB2.0 control will be used in the recently developed PicoTAP Boundary Scan controllers. Additionally, they can be included in customer designs to implement onboard system-level JTAG applications.

Aeroflex extends Capability of PXI 3000 Series with LTE TDD Measurement Suite

24 March 2011— Aeroflex announced the launch of a new software measurement suite for its PXI 3000 Series of modular instruments, to support the Time Division Duplex (TDD) mode of 3GPP Long Term Evolution (LTE) – also known as TD-LTE. The LTE TDD Measurement Suite provides LTE TDD chipset, handset and terminal device manufacturers with the advanced test capability they need to rapidly characterize device performance.

Viscom and CyberOptics Announce Cooperation for 3D Solder Paste Inspection

24 March 2011 - Viscom AG, Hannover, Germany, and CyberOptics Inc., Minneapolis, MN, USA, jointly announce an OEM agreement to equip Viscom's SPI inspection systems product line with CyberOptics' 3D SPI sensor technology. The development and supply agreement allows for the integration of CyberOptics SE500 sensor technology into the Viscom PCB inspection platforms. Viscom's S3088 SPI with the CyberOptics SE500 sensor will be shown at the upcoming SMT show in Nuremberg.

XJTAG now available with a free Layout Viewer

23 March 2011 — XJTAG announced the release of its Boundary Scan Software XJTAG version 2.5, which now includes a free layout viewer. The XJTAG Layout Viewer has been designed to improve productivity by allowing engineers to quickly visualise the exact location of faults.

Line Impedance Stabilization Network

23 March 2011 - Teseq introduces a new Line Impedance Stabilization Network (LISN) for conducted emissions testing of Grid Connected Power Conditioners (GCPC). The DC-LISN-M2-25-V1 is designed for measuring unsymmetrical disturbances on DC power ports in the frequency range from 150 kHz to 30 MHz.

Digital Radio Frequency V4 Test Solution

21 March 2011 – Agilent Technologies announced the industry’s first digital radio frequency (DigRF) V4 test solution with dual-capture capability. This software enhancement gives engineers the ability to simultaneously apply a stimulus to devices under test and analyse the results with a single instrument, the Agilent N5343A DigRF V4 exerciser.

Compact Broadband Amplifier System for EMI Applications

17 March 2011 — Rohde & Schwarz adds new functions to its R&S BBA100 broadband amplifier family to create a one-box solution. Integrated RF output switches and sample port switches allow the amplifiers to be used for many applications without the need for external switching matrices. Existing third-party amplifiers can also be integrated into the R&S BBA100 system.

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Readers Top 5 News of last 30 days

News - Board and System Test

Boundary Scan Support throughout the entire Product Life Cycle

Aeroflex extends Capability of PXI 3000 Series with LTE TDD Measurement Suite

Viscom and CyberOptics Announce Cooperation for 3D Solder Paste Inspection

XJTAG now available with a free Layout Viewer

Line Impedance Stabilization Network

Digital Radio Frequency V4 Test Solution

Compact Broadband Amplifier System for EMI Applications

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