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Readers Top 5 News of last 30 days
- 29 January 2019 - Keysight launched new 200 MHz, 4-channel Oscilloscopes
- 23 January 2019 - Predictive Maintenance for Inline AXI System
- 22 January 2019 - Frequency Response Analysis with Oscilloscopes
- 28 January 2019 - dSPACE partners with Radar Specialists miro·sys and ITS
- 24 January 2019 - Data Streaming and Visualization Service
News - Board and System Test
Application Services for Agilent AXI Systems
09 May 2011 – MatriX Technologies, a manufacturers of automatic x-ray inspection solutions in the field of electronics and NDT, now provides – in addition to its own AXI product series for electronic production (XT1300, X2 and X2.5) - an extended package of service and application support for the Agilent Medalist 5DX and X6000 AXI systems. In 2009 Agilent had completely stopped the production of automatic x-ray systems for SMT solder joint inspection in the course of restructurings.
Automated Inspection of Bonding Pads
06 May 2011 - GOEPEL electronics’ OptiCon AOI systems can now be utilised for automated inspection of bonding pads for solder splashes, deformations and any other impurities in the micrometer range. Meeting these test tasks, an additional camera module with a resolution of 3 µm is available in the AOI systems. An adaptive illumination system and particularly developed inspection functions enable highest fault detection at extremely low false-call rate.
TRI introduces new tiny ICT and fast SPI Solution
05 May 2011 – Test Research Inc. (TRI) introduced two new machines, TR5001T and TR7007. The TR5001T is a tiny in-circuit tester with high testing speeds and accuracy. This Tiny TR5001T provides a maximum of 640 test points. Savings on operation costs and space, the tiny TR5001T can meet customers’ testing needs and it still has flexible test capabilities.
Tool for AOI & SPI process improvement
05 May 2011 - Process control and improvement requires detailed information about the total manufacturing process. Indentifying process issues at the earliest opportunity saves both time and money by avoiding costly investigation and rework. Omron has developed a range of tools to aid this process and includes the unique process improvement tool, QupNavi.
Turn any USB Port into a complete Avionics 1553/429/717 Test Interface
04 May 2011 - Data Device Corporation (DDC) introduces a new Multi-I/O Advanced Avionics Tester that connects to any USB port to provide comprehensive avionics test, simulation, and analysis support. The BU-67211UX combines up to two dual redundant MIL-STD-1553 channels, with up to eight user programmable Receive/Transmit ARINC 429 channels, and up to two user programmable Receive/Transmit ARINC 717 channels, while providing support for IRIG-B, CANbus, Serial I/O, and Discrete I/O interfaces.
Nordson YESTECH upgrades AOI System and Software
02 May 2011 – Nordson YESTECH presented the latest generation FX Series AOI and upgraded YESPC software. The FX Series AOI is equally well suited for high-volume or high mix manufacturing environments, providing fast throughput and high resolution for inspection of 01005 components. Nordson YESTECH’s Advanced Fusion Lighting and 5 megapixel color image processing technology provides complete inspection coverage with extremely low false failure rates.
Test of High-Speed HSPA+ Wireless Devices
29 April 2011 - Anritsu introduces a software option for its MD8480C W-CDMA/GSM Signaling Tester that enables testing for the latest W-CDMA/GSM devices supporting simultaneous 64QAM and MIMO. The MX848001E-17 Simultaneous 64QAM/MIMO option enables the MD8480C Signaling Tester to conduct protocol-based testing on new W-CDMA/GSM wireless devices that incorporate this feature.
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- Teradyne and JTAG Technologies announce Boundary Scan Product Collaboration
- Corelis releases new Version of Boundary-Scan Tool Suite
- Two Power Sources in One Unit for EMC Tests
- Combination of Boundary Scan Test and analogue Opens/Shorts Test
- New Modular Functional Test System for Automotive Electronics
- ORPRO Vision launches new Benchtop AOI System
- JTAG-based embedded Debugger for Intel x86 Systems
- Precision Power Analyser combines Accuracy with Wideband Performance
- LTE Test Mobile supports Beamforming and 4 x 2 MIMO
- Boundary Scan Support throughout the entire Product Life Cycle
- Aeroflex extends Capability of PXI 3000 Series with LTE TDD Measurement Suite
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