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News - Board and System TestOptical Test System with Attenuation and Switch Modules03 June 2015 - Yokogawa has expanded its AQ2200 Series Multi-Application Test System (MATS) with a range of optical attenuation and switch modules for applications involving GI50 multimode optical fibre. The modular AQ2200 Series is available with two different frame controller platforms with three or nine slots for connecting modules. New Test Strategy for IoT Devices02 June 2015 - Under the name JEDOS (JTAG Embedded Diagnostics Operating System), GOEPEL electronics introduces a new technology for embedded test of complex electronic designs. The new test strategy has been developed in particular for diagnostic testing of devices for the Internet of Things (IoT). New Technology for IoT Test and Debug18 May 2015 – Teledyne LeCroy announces ProVIDE, a new, patent pending, technology created for IoT and embedded developers. IoT devices bring multiple technologies into SoCs designs, and since these technologies are defined more and more by embedded software, there is an increasing need for effective ways to develop, test and debug software and hardware interaction. ProVIDE, Protocol View for Integrated Debug Environments combines two important test and debug methods – software IDE and Protocol Analysis. Test System covers all RX in-band Test Cases for LTE FDD 3CC Carrier Aggregation12 May 2015 - The R&S TS8980 RF (pre) conformance test system from Rohde & Schwarz now features all six receiver in-band test cases for LTE FDD carrier aggregation with three downlink component carriers (3CC). Manufacturers of mobile user equipment and chipsets as well as test houses can use this to test 3CC carrier aggregation implementation in accordance with the 3GPP TS 36.101 technical specification. Highly precise and fast Inspection of Solder and Sinter Pastes11 May 2015 - GOEPEL electronics introduced a new-generation solder paste inspection system. The SPI-Line 3D allows solder pastes and sinter pastes with a height of less than 50 µm to be measured precisely and quickly. The newly developed measuring head, with double-sided projection within the device, provides the maximum degree of repeatability and reliability through its shadow-free inspection. USB 2.0 and Power Delivery Protocol Analyzer07 May 2015 – Teledyne LeCroy continues to add support for the new USB Type-C and Power Delivery 2.0 standards with introduction of the Mercury T2C USB Power Delivery and USB 2.0 Protocol Analyzer. The Mercury T2C joins the Teledyne LeCroy USB Voyager M310C, which together provide the USB development community with extensive levels of capability for test, validation and compliance of the emerging USB standards. The USB Type-C and USB Power Delivery 2.0 standards introduce entirely new USB cables and connectors expected to significantly improve user experience. SMH Technologies introduces first PXI In-System Programmer06 May 2015 - SMH Technologies developed the new universal programmer FRPXIA3. FlashRunner FRPXIA3 based on FlashRunner technology, the extremely fast and reliable programming system for Flash-based microcontroller and serial memories is the first in the world programming solution for PXI system with fully hardware and software ATE integration and Multi-target parallel programming channels. More Articles ...
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