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GOEPEL electronic improves RAPIDO Inline Systems for Programming and Test

Göpel-RAPIDIO09 January 2014 - GOEPEL electronic announced new features in the RAPIDO multi-site inline production system family for high-speed in-system programming and board test based on the latest Embedded System Access (ESA) technologies. One of the essential innovations is an option to utilize planar downholders in sandwich construction. Now ultra-thin, rigid-flexible boards with contact gaps of up to 50 mil can be safely handled in multiple-up production.

Utilizing this technology, RAPIDO has become one of only a few systems that meet the challenges of safe inline contacting for such sensitive applications.

As a second innovation, all fixtures are equipped with an intelligent module for identification and data storage. The compatibility between fixture and target board can be ensured by means of this so called FID module (Fixture Identification and Data). Additionally, there is the opportunity to automatically configure the entire system incl. band width, UUT, test program, etc. This approach avoids manual faults and provides a simple and efficient UUT change. Furthermore, the FID module determines fixture state, stores the entire life cycle, and signals required maintenance work, such as probe changing.

Other amendments include an increase in adjustable band width for standard systems to 250 mm. Moreover, new functions at the MES interface (Manufacturing Enterprise System) are implemented. 

“The extension of our RAPIDO system family gives us the opportunity to meet the demands of high-volume production particularly in the automotive and consumer industries even better”, says Alexander Beck, Team Manager Integration in GOEPEL electronic’s JTAG/Boundary Scan Division. “All developments are derived from customer concerns and the growing range of installations and applications. In association with our extensive worldwide service, we are able to deliver individually configured standard solutions with highest productivity.”

The range of RAPIDO products includes three models with different nail counts, sites and user areas. Furthermore, there are numerous options for system adaptation to specific customer needs for inline integration or programming strategies. All systems are based on the utilization of advanced ESA technologies for test and programming of highly complex boards.

All types of Flash devices such as NOR, NAND, eMMC with parallel or serial interface are supported as programming targets. In the case of Flash that is externally accessible via connectors, direct programming by means of probes is possible because RAPIDO features separate dynamic I/O. Additional targets are microcontrollers and all types of PLDs or FPGAs.

In addition to programming, there is a wide range of structural test methods and solutions for at-speed tests. The main focus concentrates on interconnection tests of Ball Grid Array (BGA) chips and functional verification of all circuit elements.

www.goepel.com/



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