|
||||
News and Information about the Test of Electronics in Research & Design, Production, Maintenance, and Installation. | ||||
Main MenuNewsletterNews AreaInfo AreaWeblinksProduct Focus |
Readers Top 5 News of last 30 days
News - Board and System Test
AOI with shadow-free 3D Measurement Technology16 June 2014 - GOEPEL electronic enhanced the OptiCon AOI systems with a revolutionary 3D measurement technology. The “3D EyeZ” sensor module of the OptiCon Advanced Line 3D is based on a Telecentric Multi Spot Array (TMSA), which measures the height of assemblies and solder joints by movable scanning. Due to the orthogonal and telecentric projection and viewing direction, error-free measuring is possible even in the gaps between the closest of components. In addition, this technology guarantees the independence of surface properties of components, solder joints and the PCB. As well as the 2D inspection tasks of a standard AOI system, solder volume, wetting angle, height and coplanarity of components can still be measured by all systems of the OptiCon family. Further outstanding features of 3D EyeZ are the freely selectable X/Y resolution as well as a maximum measurement speed of 70cm²/s. The integration is possible both in-line systems and in the well-known stand-alone AOI system the OptiCon Basic Line. Related Articles: |
Upcoming Events More events...
Tag CloudOscilloscope
JTAG
Boundary Scan
Goepel
PXI
Rohde & Schwarz
Tektronix
Keysight
AOI
Anritsu
National Instruments
Inspection
Teledyne LeCroy
Aeroflex
LTE
Yokogawa
AXI
Spectrum Analyzer
Keithley
In-Circuit-Test
Signal Analyzer
Automotive
EMC-Test
Signal Generator
Advantest
Multitest
B&K Precision
Corelis
Power Supply
SPI
Flying Prober
Teseq
Cognex
Switching
Teradyne
Viscom
Pickering
Fluke
GAO Tek
PCIe
|
||
© All about Test 2018 |