This website uses cookies to implement certain functions. If you use this website you agree to our Privacy Policy.
News and Information about the Test of Electronics in Research & Design, Production, Maintenance, and Installation.  


Register to our newsletter
Every two weeks -
all news at a glance

News - Board and System Test

In-line AOI System with 1 Top-Down and 4 Side Angle Cameras

YESTECH-FX-94011 July 2014 - Nordson YESTECH introduced the FX-940 AOI In-line PCB inspection system. The new FX-940 offers the latest multi-dimensional technology for the inspection of solder defects, lead defects / lifted leads, component presence and position, correct part / polarity, through-hole parts, and co-planarity of chips, BGAs and other height sensitive devices.

The FX-940 offers advanced Fusion Lighting and a comprehensive set of inspection tools, including angled cameras, 3D height sensors, full color digital image processing, and both image- and rule-based algorithms.

With Nordson YESTECH's advanced “capture–on–the-fly” imaging technology, the system offers high-speed inspection at over 30 sq. inches per second or greater than 1.5 million components per hour. With one top-down viewing camera and four side-viewing cameras, the FX-940 provides full inspection and traceability capabilities at today’s fastest line speeds. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield management solution.

Related Articles:

No related articles found

Upcoming Events

Nuremberg (Germany)
28 to 30 November 2017

Social Media