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News about Board and System Test

3D AOI for small-batch Production

Goepel Basic Line22 June 2015 - GOEPEL electronics launched a stand-alone AOI system with 3D measurement module. BasicLine•3D allows shadow-free, three-dimensional inspection of printed circuit boards in small and medium-sized batches. Thanks to the innovative measurement technology, the AOI system with manual loading is given an enhancement to the orthogonal camera and rotating angled-view module.

For manufacturers with lower batch sizes, the BasicLine•3D provides a powerful and flexible system that can be configured according to the individual production situations and inspection requirements.

The 3D•EyeZ sensor module is based on a Telecentric Multi Spot Array (TMSA), which measures the height of assemblies and solder joints using a scanning process. Due to the orthogonal and telecentric projection and viewing direction, it is even possible to measure accurately in the gaps between the closest of components. This technology also ensures that the surface properties of the assembly remain independent.

Thanks to the extended scope of testing, it is now also possible to measure solder volumes and the wetting surface of solder joints, as well as the height and coplanarity of components. These features are also included in the new AOI software PILOT 6. It is characterised in particular by fast and convenient creation of test programs. The integrated SmartGuide is a touchscreen operating concept in the style of an app and is also easy to use, even for inexperienced users.

www.goepel.com/



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