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Inline 3D Topographical & Imaging AOI
14 January 2016 - The completely new ISO-Spector from AOI manufacturer Mek (Marantz Electronics) is an AOI system for the full across-the-board inspection of components and solder joints. Unlike other methods of height measurement, ISO-Spector technology enables inspection of heights up to 30 mm (1.2"), and is practically immune to vibrations from nearby placement machines which might otherwise cause blurry images and therefore inaccurate and non-repeatable results during production.
It is able to inspect the world’s smallest chip size of 008004 (50% of 01005") and features a full profile simultaneous 2D and 3D inspection while maintaining high inspection speed using patented sensor technology.
The image capturing sensor has a 12 Mega Pixel resolution with optical fibre interface. The ISO-Spector enables accurate height measurement by using front & rear, close to vertical, high energy, high-end violet lasers. These lasers, combined with proprietary algorithms, result in the minimization of blind spots (shadow) and the effect of reflecting objects. Warped PCB’s up to 4 mm (160 mils) are compensated for on the fly by the Z-axis and complex compensation algorithms.
Unique for these type of inspection systems, the ISO-Spector can be programmed and debugged offline using the offline programming and debugging stations. The 3D AOI system is ergonomically designed and operated via a full touch screen.
ISO-Spector integrates fully with the FIBER system for classification, repair, traceability and SPC.
Oscilloscope JTAG Boundary Scan Goepel PXI Rohde & Schwarz Tektronix Keysight AOI Anritsu National Instruments Inspection LTE Aeroflex Teledyne LeCroy Yokogawa In-Circuit-Test Keithley AXI Spectrum Analyzer Signal Analyzer Automotive EMC-Test Advantest Multitest B&K Precision Signal Generator Corelis Flying Prober Cognex SPI Teseq Power Supply GAO Tek Pickering Fluke Teradyne Switching Viscom PCIe
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