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News - Board and System Test

Viscom_S3016_72dpiFast and reliable AOI for bottom side assemblies

01 February 2011 – The S3016 inspection system from Viscom is especially designed for inspecting the underside of assemblies. In particular, this inspection concept is employed for THT or selective soldering joints as well as with wave-soldered components in solder frames. The S3016 allows users to reliably inspect the bottom side of printed circuit boards, for example, if a heavy assembly cannot be rotated or the solder frame cannot be sufficiently locked into place.

In addition to reflow soldered SMD components, through-hole components, such as connectors or large capacitors are used, which largely require selective or wave soldering. Inspecting assemblies from below also enables in-line inspection immediately after the wave soldering and eliminates the costs associated with flip stations.

Viscom now offers the S3016-AOI equipped with powerful 8M camera technology, which allows throughput to be increased by up to an additional 30 %. Thanks to the integrated OnDemandHR function, the resolution for each analysis can be configured to 11.7 or 23.4 µm/pixel without diminishing image field size. This function enables the AOI operator to inspect selective areas of the assembly in high resolution, e. g. when searching for minuscule tin beads or hairline bridges.

The system can be connected to all standard systems in a cascaded configuration, allowing simultaneous inspection from above. Of course, all Viscom auxiliary modules, such as offline programming, SPC evaluation and classification are also available for the S3016. The tried and tested EasyPro interface provides users with straightforward navigation and fast programming capabilities.

http://www.viscom.com


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