News - Board and System Test

MIRTEC presents new 2D/3D In-Line AOI Series

15 April 2013 – MIRTEC will highlight its 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION 3D Inspection Technology in Booth # 7-504 at the SMT/Hybrid/Packaging 2013 exhibition and conference, scheduled to take place April 16-18, 2013 in Nuremberg, Germany.

The all new MV-9 2D/3D In-Line AOI systems are configured with MIRTEC’s revolutionary OMNI-VISION 3D Inspection Technology that combines MIRTEC’s exclusive 15 Mega Pixel 2D ISIS Vision System with a proprietary 3D Digital Multi-Frequency Moiré System to provide precision inspection of SMT devices on finished PCB assemblies. 

MIRTEC’s Six Phase Lighting System uses multi-color LEDs to illuminate inspection areas from six different angles providing superior solder joint characterization and co-planarity inspection of leads on gull-wing devices. 

Additionally, MIRTEC’s revolutionary Digital Multi Frequency Quad Moiré Technology, provides true 3D inspection of SMT devices on finished PCB assemblies using a total of four (4) Moiré Inspection Probes. Fully configured, the new MIRTEC MV-9 machines also feature four 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel Top-Down Camera.

www.mirtec.com/

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