This website uses cookies to implement certain functions. If you use this website you agree to our Privacy Policy.
News and Information about the Test of Electronics in Research & Design, Production, Maintenance, and Installation.  

Newsletter

Register to our newsletter
Every two weeks -
all news at a glance
captcha 

News - Board and System Test

 YXLON improves AXI resolution and user friendliness

YXLON-Cheetah201405 May 2014 - YXLON International has increased the performance capability and user friendliness of its Y.Cougar and Y.Cheetah microfocus X-ray systems once again with the System Release 3.8 for the FeinFocus product lines. The AXI systems are being presented from the 6th to the 8th of May at the SMT Hybrid Packaging trade fair in Nuremberg together with these new functional enhancements and improvements.

Resolution and the resulting image quality of captured radioscopic images is being improved once again through the new version of Y.FGUI (YXLON FeinFocus Graphical User Interface).

Intuitive operation of the microfocus X-ray systems has been equally optimized further. The System Release has not only made user guidance even easier: the enhanced automation of programming enables the systems to be parameterized faster, too.

The new additional 3D option termed “Y.micro3D slices” allows the highly detailed laminography of larger electronic printed circuit boards and increases the inspection flexibility of both system families.

The Y.Cougar and Y.Cheetah X-ray systems for 2D and 3D microfocus inspection are particularly compact systems for the rapid radioscopic inspection of smaller parts in real time. The first radioscopic image is created in a few seconds using these units. Functions such as “Click & Center”, “Frame & Zoom”, “Click & Fly” and “Grid Inspection” can be carried out with one click and distinctly facilitate working with these inspection systems.

As a result, even inexperienced users can quickly capture brilliant images. Whereas the current System Release has already been installed in the case of new systems, thanks to the extensive upgrade program at YXLON existing systems can equally be brought up to date, too.

The CT systems, including the new System Release, can be experienced in practical application from the 6th to the 8th of May at the SMT Hybrid Packaging trade fair in Nuremberg at Booth 523 in Hall 7.

www.yxlon.com/

 



Related Articles:

Upcoming Events

Control 2024
Stuttgart (Germany)
23 to 26 April
Automotive Testing Expo Europe 2024
Stuttgart (Germany)
04 to 06 June
PCIM 2024
Nuremberg (Germany)
11 to 13 June

  More events...
  See our Trade Show Calendar
  Click here