News - Board and System Test

New Post Reflow AOI System from OMRON

03 November 2014 - OMRON launched with the VT-S730 a new Post Reflow AOI system and completes the existing "VT-S Series". In addition to the color highlight 3D solder shape reconstruction technology, this new machine is now equipped with a specific phase shift inspection technology that makes it a highly efficient inspection system.

With this new COMBO Technology called 3D-SJI , the VT-S730 can easily detect lifted lead, lifted component, component coplanarity, as well as giving a very high quality in solder joint inspection.

The VT-S730 system allows the user to fully comply with IPC/ISO-TS rules and qualify all SMT process using a unique 3D technology.

The new advanced software platform of the VT-S730 allows very fast and simple programming. Real 3D AOI technology gives extremely accurate images and measurements to define clearly the quality level to achieve.

OMRON also offers a Process Improvement Tool called Q-upNavi. The expert system Q-upNavi provides integrated software tools for the monitoring and improvement of each stage of the manufacturing process including solder paste screen printing, placement, reflow, post solder inspection and X-ray. This module allows complete analysis of the flow of information relevant to the real faults immediately and continuously identifying the real source and therefore enabling targeted intervention. QupNavi also displays 3D images of the defects found by VT-S730, therefore the operator can more easily study and qualify the defects.

Using the VP6000-V (3D Solder Paste Inspection), VT-S500 (3D Pre & Post Reflow Solder joint Inspection), VT-S720 (3D Solder Joint inspection), VT-S730 (Full 3D Solder and component inspection) and VT-X700 (Post reflow, X-Ray Inspection True 3D CT), OMRON offers a complete range of high quality 3D inspection machines for each stage of the manufacturing process.

www.inspection.omron.eu/

• Prev
• Next