Nordson YESTECH: New High Speed Automated Optical Inspection Solution

07 November 2011 - Nordson YESTECH will feature the new high speed FX SL advanced AOI inspection system for populated printed circuit boards, at the 19th annual Productronica 2011 show in Hall A2, booth 339. Held at the New Munich Trade Center, in Munich Germany from November 15-18, they will conduct live demonstrations in the booth of their complete line of AOI and AXI inspection systems.

Nordson YESTECH’s FX SL AOI offers accelerated throughput at over twice the inspection speed of previous generation systems without sacrificing the defect coverage and extremely low false failure rate. The FX SL saves valuable inspection time, delivering high speed automated inspection of solder and lead defects, component presence and position, correct part, polarity and through-hole parts. Programming is also fast and easy, with operators typically taking less than 1 hour to create a complete inspection program, including solder inspection. The FX SL AOI is equally well suited for high-volume or high mix manufacturing environments, providing fast throughput and high resolution for inspection of 01005 components. The system utilizes a standard package library to simplify training and insure program portability across manufacturing lines. The FX SL, with Nordson YESTECH’s Advanced Fusion Lighting and 5 megapixel image processing technology, including color inspection, normalized correlation and rule-based algorithms, provides the industry’s most advanced AOI inspection solution to date.

Nordson YESTECH’s advanced technology X3 Automated X-Ray Inspection System (AXI) provides electronics manufacturers 3D inspection capability for fast and complete inspection of double sided PCBs with BGAs and other critical solder joints. The X3's proprietary tomographic imaging technology rapidly gathers multiple oblique images to digitally construct three dimensional renderings that are used for unobstructed inspection of solder and component related defects on double sided boards. Multiple slices, or inspection planes, can be generated from the same set of oblique images at any time. The X3 offers the advanced image resolution available today, which is critical for maximum defect detection.

“We are very pleased to be showcasing our newest AOI and AXI solutions at this year’s Productronica,” said Don Miller, Nordson YESTECH’s President. “It is great opportunity to meet with our valued customers in the region, and to introduce them to the latest enhancements to our inspection technologies.”