X-Ray Inspection with high Resolution and new Imaging Software

04 July 2011 — The new phoenix x|aminer from GE’s Inspection Technologies business is a 5-axis, microfocus X-ray inspection system, which has been developed for quality control applications in the manufacture of electronics sub-assemblies. It is particularly suitable for the reliable and accurate inspection of soldered joints. The phoenix x|aminer features two megapixel high resolution and high magnification.

In addition, its powerful imaging software permits intuitive programming and component manipulation is precise and easy using a computer mouse or joystick.

As Tobias Neubrand, product manager GE’s phoenix electronics inspection line, explains, “The reliability of electronic sub-assemblies strongly depends on solder joint quality and with today’s manufacturing technology, many solder joints are no longer directly visible. The x|aminer is the latest addition to our electronics sub-assembly inspection portfolio and offers reliable defect recognition in a system which can be easily automated, with an inspection area that can accept large printed circuit board assemblies.”

An important design feature of the new system is its ovhm (oblique view high magnification) module, which allows an oblique angle view of up to 70° as well as a total magnification of up to > 23,000x. This ensures best possible quality of defect information in the vertical direction. Ease of maintenance is also permitted with the system’s open, 160 kV microfocus tube design, whose easy cathode replacement ensures unlimited operating life, while its 20 W of tube power at target can penetrate even the most radiation-absorbing components.

The new x|aminer is supplied with the recently launched phoenix x|act software, which is designed specially for electronics inspection. Its simple macro recording permits intuitive programming of inspection tasks in terms of position and image parameters, with all display settings saved with just one mouse click. Automatically created sample maps can be used for all pcbs of the same type anywhere in the system, even when rotated and flipped, and automatic image enhancement improves live images to ensure greater probability of defect detection.