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Readers Top 5 News of last 30 days
News - Component TestQuick and easy Test Socket Replacement04 May 2018 - Multitest’s Quick Lock Contact Unit Holder (CUH) for ecoAMP and DuraKelvin Plunge-to-Board set-ups on the MT9928 gravity feed handler has been adopted as the standard mounting solution by one of Multitest’s largest automotive customers. Quick Lock demonstrated substantial reductions in maintenance, debugging, and repair times. High-Speed Tester for next Generation LP-DDR5 and DDR5 Memories09 April 2018 – Advantest introduced its T5503HS2 memory tester, the industry’s most productive test solution for the fastest memory devices available today as well as next-generation, super-high-speed DRAMs. The new system’s flexibility extends the capabilities of the T5503 product family in the current “super cycle,” in which global demand for memories is skyrocketing. Testing Service for CMOS Image Sensor Wafers30 March 2018 - Testing CMOS image sensors on a wafer-size scale is not easy because of the challenges of creating uniform illumination over a large area. Presto Engineering has developed a custom, computer-controlled solution that illuminates sections of the wafer in turn. Integrating the results enables the whole wafer to be tested automatically for an array of large sensors or even sensors that are right up to the size of an entire 12-inch wafer. High Speed Probe Card with Data Rates up to 6 Gbps27 March 2018 - aps Solutions GmbH, an authorized distributor of Sedicon Technology from Korea, introduced a new solution for High Frequency Cantilever Probe Cards up to 10 GHz @-3dB or 6 Gbps. High quality Cantilever Probe Cards are offering many advantages for customers. Especially on cost of ownership, robustness, repair ability and delivery time Cantilever Probe Cards are unbeaten. Up to now, the frequency range of High Speed Probing was limited to test frequencies < 1 GHz. Test of 6DOF Gyro Sensors in Singulated Packages22 March 2018 - Multitest launched the next generation of its 6DOF gyro test module for singulated packages, which provides significant production benefits resulting in even lower cost of test, enhanced test accuracy and higher daily output. The new generation 6DOF module has been optimized for operational cost, uptime and stimulus clearness and accuracy. Contactors for Testing Wafer Level Chip Scale Packages08 March 2018 - Multitest introduced the Gemini Kelvin 050 for 0.5mm pitch contacting for packages with continuously shrinking dies, which are needed for smaller, lower current, and faster end-user devices. The Gemini Kelvin contactor is very versatile and can be configured for: single site test, strip test, and multisite WLCSP test. Parametric Test Solution with “TRUE” Per-Pin Architecture01 March 2018 – Keysight Technologies announced the third generation of its P9000 series massively parallel parametric test system. The system accelerates the fast ramp of new technology and reduces the cost-of-test in the development and manufacturing of advanced semiconductor logic and memory ICs. For example, with the new types of device structure and higher performance, the required amount of parametric test data per advanced technology node (less than or equal to 20 nm) is drastically increasing. More Articles ...
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