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Readers Top 5 News of last 30 days
News - Component TestHigh Volume Testing of Fingerprint Sensors02 August 2016 - Multitest’s InStrip has been selected to be the platform of a set up for high parallel testing of fingerprint sensors in China. The solution relies on Multitest’s well established and production proven InStrip / InCarrier, which is extended to fingerprint testing by a dedicated conversion kit (CK). Cost-Effective Testing of RF Semiconductors07 July 2016 - Advantest introduced its Wave Scale generation of channel cards for the V93000 platform, which delivers unprecedented levels of parallelism and throughput in testing radio-frequency (RF) and mixed-signal ICs for wireless communications. Designed for highly parallel multi-site and in-site parallel testing, the new V93000 Wave Scale RF and V93000 Wave Scale MX cards substantially reduce the cost of test and time to market for today's RF semiconductors while creating a path for testing future 5G devices. Cost-efficient RF Contactor Solution for FBGA, QFN and Wafer-Level Packages30 June 2016 - Multitest introduced the ACE Contactor, which offers optimal RF performance for fine pitch FBGA, QFN and wafer-level packages. Typical applications for this new contactor are Power Amplifiers, RF switches and mobile communications. The ACE probe has a revolutionary new architecture, which provides exceptional electrical performance, both DC and RF. Advantest ships 800th V93000 Port Scale RF Tester27 June 2016 – Advantest has installed its 800th V93000 Port Scale RF test system, with the landmark unit going into the production facility of Jiangsu Changjiang Electronics Technology Co. Ltd. (JCET), a leading Chinese semiconductor packaging assembly and test company in the Jiangsu Province of China. The newly installed system is equipped with a Pin Scale 1600 digital card, Port Scale RF subsystem and MB-AV8+ analog card to meet JCET’s needs in testing RF-based system-on-chip (SoC) devices and 3G/4G/LTE RF transceivers for mobile phone applications. Tri-Temp Gravity Handler supports SOT23 Packages21 June 2016 - Multitest recently shipped a high volume test handling solution for SOT23 packages. The innovative conversion kit design allows for tri-temp testing of SOT23 packages on the production proven MT9928 gravity handler. Traditionally, these packages were handled on turret handlers, but these types of handlers do not support temperature testing. With a growing number of SOT23 application, which require testing at various temperatures, this is no longer sufficient. Die-Level Handling System for KGD Test Strategy14 June 2016 – Advantest Corporation introduced its HA1000 die-level handler, a cost-efficient test solution for determining known good dies (KGD) prior to IC packaging. The HA1000 is designed to handle a wide variety of devices from large high-power server/GPU type devices to small system-on-chips (SoCs) and memory devices/stacks, such as HBM2. Contactor for Large I/O Count BGA Devices09 June 2016 - Multitest launched the Atlas contactor, which has been optimized for cost-efficient and reliable testing of high end digital high ball count BGAs. Based on the well-established Multitest QuadTech flat probe technology, the Atlas contactor combines advanced mechanical and electrical probe technology for improved functionality and performance in manual test and automated test. More Articles ...
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