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News - Component Test
Engineering Test Station for Solid-State Drives (SSDs)18 August 2014 – Advantest introduced the next product in its MPT3000 family for testing advanced solid-state drives (SSDs) by launching the flexible MPT3000ES engineering station. While using the same high-performance electronics and powerful software as the original MPT3000 unit, the new station features a small footprint configured to test up to eight SSDs in parallel. The system’s small size and ability to plug into a standard AC outlet enable users to conduct program development and interactive device debugging in either office or lab settings.
Device Capacitance Analyzer for Power Circuit Design15 August 2014 – Agilent Technologies / Keysight Technologies introduced the industry’s first power device capacitance analyzer that automatically characterizes power device junction capacitances using real operating voltages. With the increasing use of power devices fabricated from emerging materials like SiC and GaN, switching power supplies are now operating at increasingly higher frequencies. As a result, accurate device capacitance characterization is more important than ever.
Advanced Packaging Process Control13 August 2014 - Rudolph Technologies announced its new SONUS Technology, designed for measuring thick films and film stacks used in copper pillar bumps and for detecting defects, such as voids, in through silicon vias (TSVs). SONUS Technology is a non-contact, non-destructive acoustic metrology and defect detection technique that is designed to be of higher resolution, faster, and less costly than alternative techniques.
Floating Power Source to test High-Voltage and High-Current ICs06 August 2014 – Advantest launched its new PVI8 floating power source, which extends the capabilities of its market-leading V93000 test platform for high-voltage and high-current testing of embedded power devices. This enhancement gives the V93000 sufficient power and enough analog and digital channels on a single platform to conduct highly parallel, cost-efficient testing of embedded power ICs.
2D and 3D Semiconductor Inspection and Metrology Platform06 August 2014 – Camtek launched its next generation Semiconductor Inspection and Metrology platform. The Eagle product line is designed to support the fast growing Advanced Packaging market using cutting edge technologies, both software and hardware, that deliver unparalleled 2D and 3D inspection and metrology capabilities on the same platform.
Accurate Test Solution for USB 3.1 Receivers01 August 2014 – Agilent announced a highly accurate test solution for characterizing USB 3.1 receivers. Using the Agilent USB 3.1 receiver test set, design and test engineers in the semiconductor and computer industry can now accurately characterize and verify USB 3.1 receiver ports in ASICs and chipsets.
Probes for high-accuracy on-wafer Measurement from 220 GHz to 1.1 THz31 July 2014 - Cascade Microtech launched the T-Wave series of waveguide probes for on-wafer probing of millimeter wave and sub-millimeter wave circuits. The new T-Wave probe series includes millimeter and sub-millimeter wavelength on-wafer ground-signal-ground probes and associated components for electrical measurement of devices and materials with frequencies up to 1.1 terahertz. More Articles ...
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