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News - Component Test
Advanced Packaging Process Control13 August 2014 - Rudolph Technologies announced its new SONUS Technology, designed for measuring thick films and film stacks used in copper pillar bumps and for detecting defects, such as voids, in through silicon vias (TSVs). SONUS Technology is a non-contact, non-destructive acoustic metrology and defect detection technique that is designed to be of higher resolution, faster, and less costly than alternative techniques.
Floating Power Source to test High-Voltage and High-Current ICs06 August 2014 – Advantest launched its new PVI8 floating power source, which extends the capabilities of its market-leading V93000 test platform for high-voltage and high-current testing of embedded power devices. This enhancement gives the V93000 sufficient power and enough analog and digital channels on a single platform to conduct highly parallel, cost-efficient testing of embedded power ICs.
2D and 3D Semiconductor Inspection and Metrology Platform06 August 2014 – Camtek launched its next generation Semiconductor Inspection and Metrology platform. The Eagle product line is designed to support the fast growing Advanced Packaging market using cutting edge technologies, both software and hardware, that deliver unparalleled 2D and 3D inspection and metrology capabilities on the same platform.
Accurate Test Solution for USB 3.1 Receivers01 August 2014 – Agilent announced a highly accurate test solution for characterizing USB 3.1 receivers. Using the Agilent USB 3.1 receiver test set, design and test engineers in the semiconductor and computer industry can now accurately characterize and verify USB 3.1 receiver ports in ASICs and chipsets.
Probes for high-accuracy on-wafer Measurement from 220 GHz to 1.1 THz31 July 2014 - Cascade Microtech launched the T-Wave series of waveguide probes for on-wafer probing of millimeter wave and sub-millimeter wave circuits. The new T-Wave probe series includes millimeter and sub-millimeter wavelength on-wafer ground-signal-ground probes and associated components for electrical measurement of devices and materials with frequencies up to 1.1 terahertz.
Inspection and Review Solutions for 16nm Node30 July 2014 - KLA-Tencor announced four new systems — the 2920 Series, Puma 9850, Surfscan SP5 and eDR 7110 — that provide advanced defect inspection and review capability for the development and production of 16nm and below IC devices. The 2920 Series broadband plasma patterned wafer, Puma 9850 laser scanning patterned wafer, and Surfscan SP5 unpatterned wafer defect inspection systems deliver enhanced sensitivity and significant throughput gains.
Hioki launches new Insulation Tester23 July 2014 - Hioki E.E. Corporation launched the Insulation Tester ST5520. In order to ensure the safety of electronic components such as relays and connectors and of lithium-ion and other batteries used in electric vehicles and smartphones, it is necessary to qualify their insulation characteristics, and testing system manufacturers vie to offer instruments capable of high-volume, high-speed testing. More Articles ...
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