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Readers Top 5 News of last 30 days
News - Component TestCascade Microtech acquires Aetrium’s Reliability Test Products Business13 August 2013 — Cascade Microtech acquired the ReliabilityTest Products (RTP) business of Aetrium Incorporated, a U.S. public company. The RTP business specializes in package- and wafer-level reliability (WLR) solutions for wafer process technologies; the product line strengthens Cascade Microtech’s position as a worldwide leader in the design, development and manufacture of advanced wafer probing solutions for the electrical measurement and test of semiconductor integrated circuits.
Advantest enters Market for Test of Protocol-Based Flash Storage29 July 2013 - Advantest has entered the market for testing advanced PCI Express (PCIe) 3.0 NVMe solid-state drives (SSDs) for enterprise and consumer applications with the versatile NEO-SSD platform, on which the company is building a family of test solutions that are scheduled to begin shipping to customers in the fourth quarter of this calendar year. KLA-Tencor enhances its Defect Inspection and Review Portfolio26 July 2013 - KLA-Tencor announced the new 2910 Series optical wafer defect inspection platform with NanoPoint technology and the new eDR-7100 electron-beam wafer defect review system. Meeting IC manufacturers' need for accelerated defect sourcing on advanced devices, these two tools combine increased speed with seamless connectivity to quickly find and identify defects that inhibit yield and reliability.
Meyer Burger and LayTec cooperate on Metrology Solution for PV Modules18 July 2013 - LayTec announced its cooperation with Meyer Burger, a global technology group specializing in systems, product equipment and services along the photovoltaic value chain including the manufacturing processes for wafers, solar cells, solar modules and solar systems. Combined efforts of both companies resulted in the world’s first fully integrated EVA cross-linking metrology solution for PV module production lines. Nordson DAGE launches new 4000 Optima Bondtester15 July 2013 – Nordson DAGE launched its new 4000 Optima Bondtester with unique multifunction cartridge (MFC). The 4000 Optima delivers unrivalled performance to meet and exceed test standards combined with ultimate speed and flexibility. The combination of patented technology and superior ergonomics with intelligent and intuitive software provides repeatable and reproducible results. Free Web-Based Seminar examines Curve Tracer for Testing Power Semiconductors15 July 2013 - Keithley Instruments is offering a free, web-based seminar titled “Testing Modern Power Semiconductor Devices Requires a Modern Curve Tracer.” This event, which is available for on-demand viewing, will discuss the curve tracing challenges posed by today’s power semiconductor devices and will teach viewers how to perform both I-V and high voltage C-V measurements with a modern parametric curve tracer.
Test System for NAND Flash and NAND-based MCPs used in Mobile Electronics12 July 2013 - Advantest announced that the T5831 system for testing next-generation ICs used in mobile applications, including NAND Flash with high-speed ONFi or Toggle Mode interfaces as well as managed NAND devices such as embedded multi-media cards (eMMC), is now being delivered to customers. The versatile tester also supports concurrent testing of both NAND Flash and mobile DRAM in a multi-chip package (MCP). More Articles ...
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