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News - Component TestUniversal DPS Pin Cards for SoC Test System28 Januar 2021 – Advantest announced that its DC Scale XPS256 Device Power Supply (DPS) card, developed for use with the V93000 EXA Scale SoC test system, is now ramping to production-volume test at leading makers of communications processors. Providing the industry’s first universal DPS pin capability, the XPS256 delivers high accuracy, performance and dynamic response for a variety of data-driven applications. Cloud-based Data Analysis Platform for Semiconductor Design and Production19 January 2021 – Advantest and its partner PDF Solutions Inc. introduced two new innovative cloud-based software solutions: the Advantest V93000 Dynamic Parametric Test (DPT) system powered by PDF Exensio DPT, and an edge high performance compute (HPC) system. These solutions are part of the newly introduced Advantest Cloud Solutions (ACS), an ecosystem of cloud-based products and services. At the core of this ecosystem is the data- and analytics-focused platform, Advantest Cloud powered by PDF Exensio, which Advantest is co-developing with PDF Solutions. Testing of D-PHY and C-PHY Imaging ICs for Smart Phone Cameras21 December 2020 – Advantest launched a new high-speed CMOS image capture module for its T2000 test platform that enables highly parallel, 64-site testing of both D-PHY and C-PHY devices for the rapidly growing smart phone market. The new T2000 4.8-Gbps CMOS image capture module, known as the 4.8GICAP, is designed to efficiently transfer data from CMOS image sensors (CIS) to the T2000 tester’s high-performance image processor engine (IPE). General-Purpose Hardware for Testing SoC and Power Management ICs16 December 2020 – Advantest introduced two new general-purpose hardware instruments – the 500MDM digital module and the DPS32A power supply module – to boost the capabilities of its T2000 test platform for a variety of applications such as system-on-a-chip (SoC) devices, power-management ICs, automotive devices and CMOS image sensors for the growing digital transformation market. Both new hardware units can be retrofitted onto existing test systems, such as the T2000 AiR platform whose compact design is ideal for use in environments ranging from engineering labs to volume manufacturing. Automated Test Cell for IC Testing07 December 2020 - Advantest and STMicroelectronics, a global semiconductor supplier, have jointly developed a fully-automated final-test cell system that improves overall equipment efficiency and quality in semiconductor test and packaging operations. The pilot system has been deployed at ST’s back-end fab in Muar, Malaysia. The advanced test cell is comprised of Advantest’s T2000 SoC test system and M4841 tri-temp automotive handler, equipped with a fleet of Autonomous Robotic Vehicles (ARVs) programmed to move trays of devices between the material repository and handler, all under the control of an ST Test Cell Controller (STCC). Parametric Test System for Wide Bandgap (WBG) Semiconductors19 October 2020 - Tektronix released the new Keithley S530 Series Parametric Test System with KTE 7 software and other enhancements. The S530 platform enables semiconductor fabs to add parametric test capacity for high-growth new technologies while minimizing CAPEX investment and maximizing wafers per hour efficiency. This reduced overall cost of ownership profile helps manufactures meet aggressive price pressures in competitive new markets. Inline X-ray System for High-Throughput Wire Bond Inspection08 October 2020 – Viscom introduced the new X7056-II BO system, which inspects bond wires optically and radiographically in an inline system at maximum inspection depth, ensures comprehensive inspection of power semiconductors and encapsulated sensor elements alike. The new system effectively combines optical wire bond control with X-ray inspection to reliably and precisely inspect wire bonds – even enclosed ones – and concealed solder joints beneath chips. More Articles ...
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