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Wafer Edge Profile, Film Edge Metrology and Edge Defect Inspection in One Tool

07 September 2010 –KLA-Tencor Corporation, a supplier of process control and yield management solutions for the semiconductor and related industries, announced the latest addition to its industry-leading VisEdge family of products: the VisEdge CV300R-EP edge metrology and inspection tool.

The VisEdge CV300R-EP introduces two edge-metrology capabilities designed to help fabs identify potentially yield-impacting irregularities in the shape of the wafer edge profile or in the edges of films deposited on the wafer. These new metrology capabilities add to the edge defect inspection and review capabilities of current VisEdge systems, making the VisEdge CV300R-EP a comprehensive tool for helping fabs improve yield issues associated with the wafer edge.

Semiconductor fabs print die as close to the wafer edge as possible to maximize the number of devices per wafer. However, die near the wafer edge typically show the lowest yield. To address edge-yield issues, fabs need to control where the edge of each film lands–on the planar front surface of the wafer or past the planar surface into the sloped bevel–and match the perimeter of each film to those of films deposited before and after it during device processing. VisEdge CV300R-EP provides a calibrated measurement of the profile of the wafer edge, including the slope of the bevel on which the film edge may land. In addition, VisEdge CV300R-EP is the first system to incorporate data from patterned edge die –including partial die – to trace the film edge and its concentricity with the wafer itself or with neighboring films in the process. Other solutions omit data from patterned areas, a method that may result in less accurate tracing of the film edge.

The new algorithms and new edge-profile module of the VisEdge CV300R-EP inspection and metrology system enable the following capabilities:

Simultaneous edge defect inspection and multi-layer edge metrology in the near- edge and top bevel regions of the wafer—now including patterned areas, to provide greater coverage and more accurate determination of the film edge

Multi-channel (specular, scatter, phase) defect imaging and binning in the near-edge, top and bottom bevel, and apex regions of the wafer

On-board high-resolution review microscope

Calibrated edge profile measurements of all sixteen SEMI standard parameters, for bare wafer incoming quality control at fabs

Edge profile feedback to the metrology algorithm, for accurate measurement of film stack height ("z-cut") in the bevel

Enhanced performance on low-contrast films compared to previously announced models and the ability to detect buried edges in dielectric films

Rotating optical head, eliminating "blind spots" and "stitching" errors

KLA-Tencor's VisEdge CV300R-EP wafer edge inspection and metrology system can be purchased as a new system or as a field upgrade from the VisEdge CV300R.

www.kla-tencor.com


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