News - Component Test

Nordson DAGE opened a new Research and Development Facility

10 March 2014 - Nordson DAGE opened its new expanded Research and Development facility in Colchester, Essex, UK. The move to the new location had been planned in line with new R & D programs with subsequent headcount expansion to further drive Nordson DAGE’s Bond Test and X-ray product development programs. The move has doubled the space and added important capability including a new cleanroom facility.

The Nordson DAGE Research and Development team have already accumulated many patents for their innovative, market leading products and this move will allow acceleration of future developments to meet the exacting demands of Bondtesting and X-ray inspection customers. Examples are the newly launched XM8000 Wafer X-ray Metrology system that leverages Nordson DAGE’s unique X-ray technology for fully automatic semiconductor wafer measurements and the 4000 Optima Bondtester, both of which are used as an integral part of the fabrication and packaging of integrated circuits or as part of quality control and product acceptance.

Joseph Stockunas, Group Vice President, Advanced Technology – Electronic Systems, commented, “This Nordson DAGE Research and Development facility is a key component of the growth expectations for Nordson and a centre of collaboration for its market leading Bond Test and X-ray inspection products, all of which have been created from the ideas developed here. This site provides opportunities for us to grow to the next level as a Company and this investment confirms the level of confidence the Nordson Corporation has in Nordson DAGE and this Research and Development facility.”

Phil Vere, President of Nordson DAGE, added further, “Excellence of our engineered products is at the core of Nordson DAGE’s success. This is a large R & D investment and will provide the platform for the growth into new markets and applications.”

www.nordsondage.com/