This website uses cookies to implement certain functions. If you use this website you agree to our Privacy Policy.
News and Information about the Test of Electronics in Research & Design, Production, Maintenance, and Installation.  

Newsletter

Register to our newsletter
Every two weeks -
all news at a glance
captcha 

News - Component Test

High Resolution Error Detection for Advanced ICs

Advantest TS9000TDR Option27 November 2015 - Advantest Corporation initiated sales of its new TDR Option for the company’s TS9000 series of terahertz analysis systems. The new option enables analysis of circuit quality in semiconductors, printed substrates, electronic components, and other applications, utilizing short-pulse terahertz waves. The solution provides an extremely high spatial precision of less than 5 μm, and a maximum measurement range of 300 mm.

Electronic device circuit quality analysis is commonly performed using oscilloscope TDR (time domain reflectometry). However, as devices grow smaller and more highly integrated, the ability to locate failures with extreme spatial precision has become increasingly more important. Existing measurement instruments have limited resolution, as the rise time of the short pulse cannot be compressed much further, creating the risk that existing analysis technologies will be inadequate to handle the requirements of the highly integrated devices on the horizon.

Advantest’s terahertz analysis technology addresses these concerns and meets the need for ultra-high-resolution measurement by utilizing short-pulse terahertz waves for analysis of complex electrical circuits.

Key Features

The TS9000 TDR Option relies on Advantest’s market-proven TDT/TDR measurement technology to pinpoint and map circuit defects utilizing short-pulse signal processing. The solution delivers circuit analysis with an extremely high spatial precision of less than 5 μm, and a maximum measurement range of 300 mm, including for internal circuitry used in through-silicon vias (TSVs) and interposers.

Moreover, with the optional TDR/TDT CAD Data Link, errors located can be mapped and displayed on the CAD data of the target device, making it much easier for users to identify the causes of errors. Three types of TDR/TDT probes, each with a different resolution and measurement distance setting, are available for the TS9000 TDR Option, as are customizations for unique contact requirements.

Advantest announced the TS9000 MTA Option, a terahertz analysis system for measuring semiconductor mold thickness, in September 2014. With the launch of the TDR Option, the TS9000 Series continues to define the company’s new approach to measurement utilizing terahertz technology, adding critical support for advanced electronic device measurement and product quality management.

www.advantest.de/



Upcoming Events

EUROPEAN MICROWAVE WEEK 2017
Nuremberg (Germany)
08 to 13 October 2017

Social Media

twitter_follow_420x50px