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Semiconductor Device Modeling and Characterization Software Tool Suite
05 April 2016 – Keysight Technologies announced the newest release of its industry-leading device modeling and characterization software suite: Integrated Circuits Characterization and Analysis Program (IC-CAP) 2016, Model Builder Program (MBP) 2016, and Model Quality Assurance (MQA) 2016. The software release provides designers characterizing and modeling semiconductor devices with further advances in modeling and characterization efficiency.
Keysight’s IC-CAP 2016 software is a device-modeling program that delivers powerful characterization and analysis capabilities for today's semiconductor modeling processes. IC-CAP 2016 delivers a complete DynaFET System solution for modeling the GaN and GaAs HEMT's used in power amplifier (PA) applications. IC-CAP includes measurement and modeling software to extract Advanced Design System (ADS) DynaFET, an internally developed model for GaAs and GaN HEMT devices.
The key advantage of the ADS DynaFET model is its ability to accurately predict dynamic memory effects caused by thermal and trapping phenomena, which in turn provides unprecedented accuracy when predicting gain and power added efficiency (PAE) – two key figures of merit in RF PA circuit design. Dedicated measurement software collects large signal data with a Keysight Nonlinear Network Analyzer (NVNA). The waveforms, representing dynamic load lines measured at different RF powers, bias points and output impedances, are then fed directly to the extraction package in IC-CAP 2016. Here, the model is extracted using artificial neural network technology and can be directly used in ADS software.
Another key feature in IC-CAP 2016 is increased measurement speed for the Keysight E5270, B1500A and B1505A instrument drivers; up to three times faster compared to previous releases. The speed increase helps alleviate the challenge having to measure large amounts of data with great accuracy; a highly time-consuming process. New instrument drivers have also been added in IC-CAP 2016 to support the Keysight E4990 Impedance Analyzer and E5061B Network Analyzer.
More information about IC-CAP 2016 is available at www.keysight.com/find/eesof-iccap2016.01. An image of the software is available at www.keysight.com/find/DeviceModeling2016_images.
MBP and MQA 2016
Keysight’s MBP 2016 is a one-stop solution that provides automation and flexibility for high-volume, high-throughput device modeling, while MQA 2016 provides the complete solution and framework to fabless design companies, IDMs and foundries for SPICE model library validation, comparison and documentation. MBP 2016’s extraction package has been updated to support the industry standard BSIM-IMG version 102.6. In support of fully depleted silicon-on-insulator (FDSOI), a mainstream technology for nodes below 28 nm, Keysight is working to develop modeling technologies for the Leti-UTSOI model.
“We continue to invest in our device modeling platforms with specific focus on efficiency and emerging technologies like DynaFET and FDSOI modeling,” said Roberto Tinti, device modeling planning manager with Keysight. “Our goal is to allow modeling engineers to generate high-quality models in less time. We will also continue to collaborate with Keysight Research Labs and our global partners to develop turnkey modeling solutions for the advanced technologies in our platforms.”
MBP 2016 also introduces a new statistical corner tuning module that is designed to further increase daily modeling efficiency. The module integrates all of the necessary components for tuning or automated optimization, including pre-defined targets and plots.
MQA 2016 delivers improved support for the advanced 16-nm TSMC Modeling Interface (TMI) library and mixed SPICE syntax. The latter capability is important since as technology nodes becomes smaller, SPICE model libraries become more and more complex. In addition, MQA 2016’s 64-bit operating system support makes the software now suitable for loading and managing large-size model libraries and data.
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