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News about Component Test
Cost-efficient RF Contactor Solution for FBGA, QFN and Wafer-Level Packages
30 June 2016 - Multitest introduced the ACE Contactor, which offers optimal RF performance for fine pitch FBGA, QFN and wafer-level packages. Typical applications for this new contactor are Power Amplifiers, RF switches and mobile communications. The ACE probe has a revolutionary new architecture, which provides exceptional electrical performance, both DC and RF.
The ACE probe is manufactured from HyperCore base material, which is a proprietary material of Xcerra’s ECT Contact Products Group. HyperCore combines the mechanical properties of high carbon steel, with the electrical properties of BeCu and the non-oxidizing properties of a precious metal.
The materials and architecture create a very robust probe with a very long working life and best yield. The electrical and mechanical performance, combined with the long probe life, deliver low overall cost of test, which are unprecedented for RF contactors.
Within the range of applications the ACE probes are compatible with all device types, platings, and pitches; and all test applications, including singulated devices, strip test and wafer-scale test. The ACE contactor supports pitches down to 0.4 mm.
Jason Mroczkowski, Director RF Product Development and Marketing explains: “ACE contactor has been evaluated by initial customers, which report significant improvements compared to other solutions: More than double- the probe life and substantially better figures for current consumption, gain, standard deviation, and power efficiency.”
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