|News and Information about the Test of Electronics in Research & Design, Production, Maintenance, and Installation.|
News about Component Test
Low-Volume Testing of Highly Integrated Modules and System-in-Package (SiP) Devices
23 November 2016 - Advantest launched the new T2000 AiR system, a compact, air-cooled system optimized for low-cost testing in R&D and high-mix, low-volume production. Shipments to customers are expected to begin in the first quarter of calendar year 2017. The T2000 AiR extends the capabilities of the established T2000 platform to serve the testing needs of IDMs, foundries and fabless semiconductor companies making IoT-enabled devices.
Global market demand continues to grow for smartphones and other mobile electronic devices as well as consumer and enterprise services offered over the internet. This trend is driving increased production of complex semiconductor devices and modules that integrate MCUs and application processors to perform multiple functions, including telecommunications, power management and sensing.
Advantest’s new T2000 AiR offers broad test coverage for these diverse modules and system-in- package (SiP) devices. With its modular architecture providing maximum flexibility, the tester can be configured with up to six discrete air-cooled measurement modules. This enables single-system test coverage for a wide array of highly integrated, multi-functional devices. Designed to perform digital functions and SCAN testing over as many as 512 channels in parallel, the system can test high-voltage devices up to 2,000 volts, high-precision DC converters, automotive DC devices, mixed-signal ICs with bandwidths up to 100 MHz, RF communication chips and CMOS image sensors.
The new tester can be integrated with the M48xx series of handlers to create a highly efficient, zero-footprint test cell solution, which Advantest refers to as its Integrated Zero Test Station. Because the T2000 AiR does not require water cooling, it can be installed anywhere. Additionally, the system’s software environment is fully compatible with the highly scalable T2000 series, making it capable of conducting massively parallel testing and facilitating smooth production ramps to help customers reduce their newest products’ time to market.
“With the new T2000 AiR, we continue to extend the capabilities of our established T2000 platform to serve the testing needs of IDMs, foundries and fabless semiconductor companies making IoT-enabled devices,” said Masayuki Suzuki, senior vice president of the SoC Test Business Group at Advantest.
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