News - Component Test

aps Solutions signs Distributor and Service Agreement with Mechanical Devices Ltd.

15 December 2015 - aps Solutions announced an agreement with Mechanical Devices from Israel, an advanced thermal solutions provider, a provider of temperature control systems/solutions that are primarily used by Semiconductor manufacturers to test their devices and wafers at precise selectable temperatures. APS is appointed by MD to their non-exclusive distributor in Germany, Austria and Switzerland.

Mechanical Devices thermal test systems perform fast, accurate, stable and cost effective solutions, using advanced and patented technologies.

With industry´s state-of-the-art temperature forcing systems Flex TC and Max TC, Mechanical Devices is changing the way of testing by controlling temperature under test, enabling semiconductor manufacturers to increase their own profitability by improving the cost efficiency of their IC and wafer test processes. MD’s systems can be integrated with automatic test equipment (ATE) and Handler in production.

Hanns-Georg Ochsenkuehn, Managing Director of APS stated, „MD’s thermal solutions are a perfect addition to our product portfolio, which is dedicated on latest test solutions, for example high performance, machined engineering test sockets, where the end-user easily can plug on MD’s technology. There is no air flow between the IC and the temperature forcing device – it’s direct attached to the IC under test.“

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