|
||||
News and Information about the Test of Electronics in Research & Design, Production, Maintenance, and Installation. | ||||
Main MenuNewsletterNews AreaInfo AreaWeblinksProduct Focus |
Readers Top 5 News of last 30 days
News - Component TestInline X-ray System for High-Throughput Wire Bond Inspection08 October 2020 – Viscom introduced the new X7056-II BO system, which inspects bond wires optically and radiographically in an inline system at maximum inspection depth, ensures comprehensive inspection of power semiconductors and encapsulated sensor elements alike. The new system effectively combines optical wire bond control with X-ray inspection to reliably and precisely inspect wire bonds – even enclosed ones – and concealed solder joints beneath chips. The unique combination of AOI and AXI in a single system ensures high-throughput handling to meet the most stringent cycle time requirements at a maximum inspection depth. Tapes and wires, whether thick or thin, are inspected, as is the soldering quality of the dies. The high-resolution sensor technology means the scope of inspection covers all bond points and wires, as well as open and concealed connection points, so that the quality of wire runs, dies and component layers, damage and position deviations as well as voids in surface soldering can be detected with absolute certainty. The standard library contains all relevant inspection patterns for die bonds, ball-wedge, wedge-wedge and security bonds for very effective inspection program generation. Viscom’s new bond inspection system offers an ideal solution for the increasing demand for X-ray inspection in the bond area. The system is designed to be used in the production of high-end electronics and is ideal for installation in final assembly for power electronics, circuits, sensor construction and packaging to ensure 100% quality control. The Viscom range is rounded off by powerful verification and evaluation of statistical process control. www.viscom.com/ Related Articles: |
Upcoming Events More events...
Tag CloudOscilloscope
JTAG
Boundary Scan
Goepel
PXI
Rohde & Schwarz
Tektronix
Keysight
AOI
Anritsu
National Instruments
Inspection
Teledyne LeCroy
Aeroflex
LTE
Yokogawa
AXI
Spectrum Analyzer
Keithley
In-Circuit-Test
Signal Analyzer
Automotive
EMC-Test
Signal Generator
Advantest
Multitest
B&K Precision
Corelis
Power Supply
SPI
Flying Prober
Teseq
Cognex
Switching
Teradyne
Viscom
Pickering
Fluke
GAO Tek
PCIe
|
||
© All about Test 2018 |