This website uses cookies to implement certain functions. If you use this website you agree to our Privacy Policy.
News and Information about the Test of Electronics in Research & Design, Production, Maintenance, and Installation.  


Register to our newsletter
Every two weeks -
all news at a glance

Latest Test and Measurement News

AOI System for bottom Side, top Side or simultaneous dual Side Inspection

MEK-SpectorBOX29 May 2014 - Mek (Marantz Electronics Ltd ) introduced several new additions to its line-up of AOI systems, including the new SpectorBOX “Bottom-Up” Modular system specially engineered for wave and selective solder THT and SMT manufacturing. The SpectorBOX which is designed to accommodate solder frames on return and/or feed conveyors.

SpectorBOX offers bottom side, top side or simultaneous dual side inspection replacing traditional board flipping alternatives in less space and at lower cost.

With its totally new mechanical platform, it is the only modular AOI in the market that can be equipped with 9 cameras, including an optional Z-axis moveable head to precisely position and focus for varying PCB distance andwarpage. With its general purpose I/O, SpectorBOX can be simply interfaced with existing or new conveyor systems.

MEK also enhanced the PowerSpector 350 desktop AOI with FDAz inspection head, which introduces a new era in capture quality. The FDAz inspection head enables 9 Camera AOI featuring Tilt-Shift & Telecentric optics with automatic Z‐axis. 8 Side cameras in 10μ resolution with Tilt‐Shift optics technology ... familiar in architectural photography... reduce image distortion to enable the best capture possible. A moveable head in Z‐Axis brings objects into optimal focus and position, independent of PCB thickness or warping. In combination with the HD 18.75μ or 10μ resolution top camera with Telecentric optics and unique multiplexed 8x CameraLink side camera technology, unprecedented defect visibility is achieved.

Related Articles:

No related articles found

Upcoming Events

Mobile World Congress 2020
Barcelona (Spain)
24 to 27 February 2020
- - - CANCELLED - - -
Embedded World 2020
Nuremberg (Germany)
25 to 27 February 2020
DATE 2020
Grenoble (France)
09 to 13 March 2020

Social Media