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News and Information about the Test of Electronics in Research & Design, Production, Maintenance, and Installation.

News about Component Test

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Title	Date
Testing High-Resolution Converters, Consumer Audio ICs and IoT Devices	13.07.17
Cost-Efficient Wafer-Level Testing of Mixed Semiconductor Memories	04.07.17
Wireless Test System supports 802.11ax, Bluetooth 5, ZigBee and Z-Wave	20.06.17
Advantest ships 5,000th V93000 Mixed-Signal Test System	15.06.17
Test of Pressure Sensors for Automotive Applications	16.05.17
Advantest Europe and Nash Technologies team for Application Engineering Services	12.05.17
Pick-and-Place Handler with additional Temperature Control Features	26.04.17
Long-live Spring Probe with 500% for high Volume Production	13.04.17
LCR Meter with up to 1 MHz Test Frequencies and 0.05% Accuracy	03.04.17
Advantest extends EVA100 Measurement System	03.03.17
Sensor Test Module for Twin Axis Stimulation	22.12.16
High Multi-Site Test of Pressure Sensors	12.12.16
Pick-and-Place IC Handler for High-Volume Production and Device Characterization	08.12.16
Testing the transmission Quality of high-speed Link Cables	06.12.16
Low-Volume Testing of Highly Integrated Modules and System-in-Package (SiP) Devices	23.11.16

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EMC Europe 2017
Angers (France)
04 to 08 September 2017

EPE '17 ECCE
Warsaw (Poland)
11 to 14 September 2017

ECOC 2017
Gothenburg (Sweden)
17 to 21 September 2017