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How to resolve AdBlock issue? Readers Top 5 News of last 30 days
- 07 October 2020 - First Traffic Generator and Emulator for PCI Express 5.0 and Compute Express Link
- 12 October 2020 - Multi-Channel 10-bit Digitizer with up to 4 GS/s Sampling Rate
- 01 October 2020 - Programmable AC Power Source delivers up to 6,000VA
- 06 October 2020 - Flexible Digital I/O PXI Instrument
- 09 October 2020 - Radar Multi-Target Simulator and Advanced Automotive Ethernet Test Software
News - Component Test
Parametric Test System for Wide Bandgap (WBG) Semiconductors
19 October 2020 - Tektronix released the new Keithley S530 Series Parametric Test System with KTE 7 software and other enhancements. The S530 platform enables semiconductor fabs to add parametric test capacity for high-growth new technologies while minimizing CAPEX investment and maximizing wafers per hour efficiency. This reduced overall cost of ownership profile helps manufactures meet aggressive price pressures in competitive new markets.
Inline X-ray System for High-Throughput Wire Bond Inspection
08 October 2020 – Viscom introduced the new X7056-II BO system, which inspects bond wires optically and radiographically in an inline system at maximum inspection depth, ensures comprehensive inspection of power semiconductors and encapsulated sensor elements alike. The new system effectively combines optical wire bond control with X-ray inspection to reliably and precisely inspect wire bonds – even enclosed ones – and concealed solder joints beneath chips.
SoC Test System targeting advanced digital ICs
02 October 2020 – Advantest announced its next-generation V93000 testers targeted at advanced digital ICs up to the exascale performance class. The systems’ new test heads incorporate Xtreme Link technology, and the EXA Scale universal digital and power supply cards that enable new test methodologies, lower cost-of-test and faster time-to-market.
Advantest started Online Portal with Access to Digital Products and Web-Based Services
06 August 2020 – Advantest Corporation introduced a new online portal enabling customers to place orders and get instant delivery of Advantest’s cloud-based services and software products, making these items available on demand, anytime and anywhere. Users can access the myAdvantest portal from any internet-connected device without having to install an app or software program.
First VNA capable of 70 kHz to 220 GHz Measurements in a Single Sweep
04 August 2020 – Anritsu Corporation demonstrated its unique new Vector Network Analyzer (VNA), which can make measurements from 70 kHz to 220 GHz in a single sweep. The ME7838G, together with MPI’s 200mm probe station, allows on-wafer measurements that span into the upper mmWave frequencies for more accurate device characterization.
Terahertz System enables high Resolution Analysis of Circuit Faults
28 July 2020 - Advantest Corporation initiated sales of its new TS9001 TDR System. The new system fully utilizes the company’s unique terahertz technology to enable non-destructive and high-resolution analysis on circuit faults in advanced semiconductor packages, such as flip chip BGAs, wafer level packages, and 2.5D/3D ICs.
Optical Wafer Testing for uLEDs at a single Test Station
17 July 2020 – Instrument Systems offers a unique camera-based measurement solution for μLED wafer testing that generates 2-dimensional, pixel-resolved optical analyses within given cycle times. The LumiTop 4000 has a resolution of 12 MP and can detect the smallest of defects and inhomogeneities on the wafer. Thanks to a 100 mm macro lens, the camera enables fast parallel inline analysis of all μLEDs on a wafer at a single test station.
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- IC Memory Tester integrates Burn-In and Core Testing for 5G Product Development
- Testing Wi-Fi 6E, Sub-8-GHz 5G, and IoT Semiconductors for Wireless Communications
- Memory Tester integrates Burn-In and Memory-Cell Test Functions in One System
- Generating Current Pulses as short as 10usec
- 5G Semiconductor Test Platform
- Photonics On-Wafer Testing Solution
- Semiconductor Test Contactor for HAST, HTOL and Burn-in
- High-Volume Testing of SoC Devices for Automotive Applications
- Measuring and Evaluating Switching Parameters of SiC, GaN Power Devices
- aps Solutions enters into Representative and Service Agreement with Hauman Technologies
- FormFactor acquires FRT GMBH
- RoodMicrotec appoints KERR as Representative in Italy
- High-Frequency LCR Meter
- Chamber-Based Solid-State Drive Validation Tester with extreme Thermal Testing
- Clamshell Socket for 896 pin BGA Packages with Heat Sink
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