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How to resolve AdBlock issue? Readers Top 5 News of last 30 days
- 27 July 2020 - Keysight Technologies acquires Eggplant
- 05 August 2020 - USB4 Test Solutions to optimize Design Performance and ensure Standard Compliance
- 14 July 2020 - Anritsu expands Portfolio of high-frequency Components
- 15 July 2020 - IC Memory Tester integrates Burn-In and Core Testing for 5G Product Development
- 16 July 2020 - Network Analyzers with high Performance Signal Generators
News - Component Test
Advantest started Online Portal with Access to Digital Products and Web-Based Services
06 August 2020 – Advantest Corporation introduced a new online portal enabling customers to place orders and get instant delivery of Advantest’s cloud-based services and software products, making these items available on demand, anytime and anywhere. Users can access the myAdvantest portal from any internet-connected device without having to install an app or software program.
First VNA capable of 70 kHz to 220 GHz Measurements in a Single Sweep
04 August 2020 – Anritsu Corporation demonstrated its unique new Vector Network Analyzer (VNA), which can make measurements from 70 kHz to 220 GHz in a single sweep. The ME7838G, together with MPI’s 200mm probe station, allows on-wafer measurements that span into the upper mmWave frequencies for more accurate device characterization.
Terahertz System enables high Resolution Analysis of Circuit Faults
28 July 2020 - Advantest Corporation initiated sales of its new TS9001 TDR System. The new system fully utilizes the company’s unique terahertz technology to enable non-destructive and high-resolution analysis on circuit faults in advanced semiconductor packages, such as flip chip BGAs, wafer level packages, and 2.5D/3D ICs.
Optical Wafer Testing for uLEDs at a single Test Station
17 July 2020 – Instrument Systems offers a unique camera-based measurement solution for μLED wafer testing that generates 2-dimensional, pixel-resolved optical analyses within given cycle times. The LumiTop 4000 has a resolution of 12 MP and can detect the smallest of defects and inhomogeneities on the wafer. Thanks to a 100 mm macro lens, the camera enables fast parallel inline analysis of all μLEDs on a wafer at a single test station.
IC Memory Tester integrates Burn-In and Core Testing for 5G Product Development
15 July 2020 – Advantest launched the new, highly versatile H5620ES engineering test system, designed for both high-speed burn-in and core testing of today’s DDR4, next-generation DDR5, and low-power, double-data-rate (LPDDR) devices in laboratory environments. By streamlining the number of accessories and reducing the time required between burn-in and core testing, the new H5620ES shrinks the cost of test for evaluating advanced memory devices used throughout 5G applications.
Testing Wi-Fi 6E, Sub-8-GHz 5G, and IoT Semiconductors for Wireless Communications
05 June 2020 – Advantest Corporation introduced the newest generation of its Wave Scale RF channel cards for the V93000 platform to address the growing market demand for Wi-Fi 6E, 5G-NR transceivers, LTE-Advanced Pro and IoT communication devices operating at frequencies up to 8 GHz. The new V93000 Wave Scale RF8 card, capable of both highly parallel multi-site and in-site parallel testing, reduces the cost of test and time to market for leading-edge radio-frequency (RF) semiconductors while also creating a path for testing future 5G-NR devices.
Memory Tester integrates Burn-In and Memory-Cell Test Functions in One System
04 May 2020 – Advantest Corporation introduced its new versatile, high-throughput H5620 memory tester that combines the capabilities to perform both burn-in and memory-cell testing for advanced DRAMs and LPDDR (low-power, double-data-rate) devices.
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- aps Solutions enters into Representative and Service Agreement with Hauman Technologies
- FormFactor acquires FRT GMBH
- RoodMicrotec appoints KERR as Representative in Italy
- High-Frequency LCR Meter
- Chamber-Based Solid-State Drive Validation Tester with extreme Thermal Testing
- Clamshell Socket for 896 pin BGA Packages with Heat Sink
- XYZTEC adds two new European Distributors
- Bond Testers feature high Forces and large Working Area
- Scalable, flexible, and accurate Validation of complex Networking SoCs
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