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3D AOI Inspection of Solder Joints

Goepel Meniskus03 April 2015 - The inspection software PILOT 6 of the AOI systems from GOEPEL electronics offers the possibility of three-dimensional inspection of solder joints on chip components and IC pins. The data of the surface topography, generated by the integrated measuring module 3D·EyeZ, can be evaluated in many ways to determine the quality of the solder meniscus. Possible functions are the measurement of the soldier height on the component or the pin as well as measuring the tin covered area on the pad and the solder volume.

The pass/fail decision is based on predefined tolerance limits for each parameter of the solder joint or the component. In addition to the 3D solder joint measuring, correctness and assembly faults can be detected. All functions are individually expandable on a modular basis and thereby offer maximum flexibility. The user thereby has access to an extensive library of pre-defined tolerances for all SMD components available.

The 3D functionality is part of the completely new AOI system software PILOT 6. Additional focus of this version is comfortable and fast test program generation with maximum inspection reliability. Highlight is the integrated SmartGuide, an operating concept for extremely simple test program generation even for unexperienced users. The handling is comparable easy as dealing with a smartphone, thanks to a clear and familiar user interface and touch screen.

www.goepel.com/



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