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Highly precise and fast Inspection of Solder and Sinter Pastes

Goepel SPI LINE 3D11 May 2015 - GOEPEL electronics introduced a new-generation solder paste inspection system. The SPI-Line 3D allows solder pastes and sinter pastes with a height of less than 50 µm to be measured precisely and quickly. The newly developed measuring head, with double-sided projection within the device, provides the maximum degree of repeatability and reliability through its shadow-free inspection.

The speed-optimized camera head keeps pace with the high production throughput without any loss of precision: 180 pictures per second up to 290 cm²/s means uncompromisingly high-speed solder paste inspections. The SPI-Pilot system software gives the user the easiest and most intuitive test program creation experience. It can be operated via a touchscreen and enables programming to be done in less than 10 minutes. The new SPI-Line 3D has also been fundamentally modified mechanically: The 3D measuring head moves through wear-free linear axes with the highest dynamics.

The SPI-Line 3D has recently added the single networking system for all inspection data from AOI, SPI and AXI by linking through PILOT Connect. This common interface centrally records and manages the machine and operating data from the linked systems. All test information can be then be brought together at one verification and repair station, where secure error evaluation and brand new possibilities for optimizing the production process can be established.

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