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Aeroflex extends Capability of PXI 3000 Series with LTE TDD Measurement Suite

24 March 2011— Aeroflex announced the launch of a new software measurement suite for its PXI 3000 Series of modular instruments, to support the Time Division Duplex (TDD) mode of 3GPP Long Term Evolution (LTE) – also known as TD-LTE. The LTE TDD Measurement Suite provides LTE TDD chipset, handset and terminal device manufacturers with the advanced test capability they need to rapidly characterize device performance.

In conjunction with PXI 3000 RF instrumentation and existing LTE FDD measurement suite, Aeroflex is now able to offer comprehensive RF parametric test capability for LTE devices operating in LTE 3GPP TDD and FDD bands.

The LTE TDD Measurement Suite is able to support all uplink and downlink configurations including special sub-frame configuration as defined in 3GPP 36.211 section 4.2. LTE analysis is supported for uplink (SC-FDMA) transmissions for all bandwidths 1.4 MHz to 20 MHz and modulation types QPSK, QAM16 and QAM64. In addition to numerical measurement results, the measurement suite provides trace displays for spectrum emission mask, CCDF, constellation plots, EVM vs. Carrier and EVM vs. Symbol. EVM analysis for uplink signals is supported for PUSCH, SRS and PUCCH.

The PXI 3000 LTE TDD Measurement Suite has been tested and verified against the Aeroflex TM500 TD-LTE standard test mobile, reflecting Aeroflex’s unique capability in end-to-end testing of LTE TDD from network infrastructure to user equipment. This addition of LTE TDD capability to the PXI 3000 completes Aeroflex’s product offering for this important standard, from R&D right through verification and servicing to manufacturing.

Price and availability

The new LTE TDD Measurement Suite for the PXI 3000 Series (3030 option 108) is now available for order.

The PXI 3000 Series, modular RF test system based on PXI technology is a proven solution to accelerate throughput in manufacturing and time to market in R&D while catering for current and future RF test needs. It is particularly suited to modern cellular and wireless data communications and critical testing in a high volume manufacturing environment.

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