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2D and 3D Semiconductor Inspection and Metrology Platform

06 August 2014 – Camtek launched its next generation Semiconductor Inspection and Metrology platform. The Eagle product line is designed to support the fast growing Advanced Packaging market using cutting edge technologies, both software and hardware, that deliver unparalleled 2D and 3D inspection and metrology capabilities on the same platform.

Ramy Langer, Vice President and Head of Camtek's Semiconductor Division, commented, “This new product line will strengthen our leading position in the Semiconductor backend market, taking advantage of our expertise in bump inspection and metrology. The Advanced Packaging market in particular uses a wide spectrum of bump types and sizes. Our outstanding capabilities in the inspection and metrology of current and next-generation bumps, down to 2µm, will give our customers a competitive edge in this emerging market."

Continued Mr. Langer: "We have already received early orders for the new product from leading Semiconductor device manufacturers. We see this as a vote of confidence in our technology capabilities to deliver fast, accurate and unrivalled 2D and 3D inspection and metrology capabilities, supporting the industry roadmap."

www.camtek.co.il/



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