06 November 2025 - Mek (Marantz Electronics) will exhibit at Productronica 2025 in Munich, Hall A2, Stand 500, showcasing its latest developments in Automated Optical Inspection (AOI) and Solder Paste Inspection (SPI) technology. The main highlight of the stand will be the brand new ISO-Spector X1 3D THT Bottom-Up AOI system, which combines advanced 3D optics and projection technology with Mek’s renowned inspection algorithms to measure through-hole solder joint volume and pin height. The system will be demonstrated publicly for the first time at Productronica and is scheduled to join Mek’s product line in January 2026.
05 November 2025 – Pickering Interfaces announced a major new addition to its extensive range of PXI FIU (fault insertion unit) switch modules: available in a compact single-slot form factor, models 40-205 (PXI) and 42-205 (PXIe) are part of the company’s two-wire serial interface fault insertion switching family. Based on MEMS (micro-electro-mechanical systems) switches, the modules are designed to simulate common faults in high-speed communication protocols, supporting the latest evolution of MultiGBASE-T1 testing requirements.
04 November 2025 – Teledyne LeCroy announced the Xena Z1608 Edun Ethernet Traffic Generator, supporting 1.6Tbps Ethernet with CR/KR-compliant 224G PAM4 (4 levels Pulse Amplitude Modulation). Designed to accommodate the quickly evolving test requirements for next-generation AI driven Ethernet technologies, the Xena Z1608 Edun delivers unmatched ease-of-use, performance and flexibility for developers working on cutting-edge networking equipment in a lab-friendly scalable form factor. Core test scenarios include validating semiconductor and network performances and ensuring multi-vendor interoperability.
03 November 2025 - Keysight Technologies introduced the AE6980T nGBASE-AU Optical Automotive Ethernet Transmitter Test Solution, the industry’s first platform to qualify next-generation optical automotive Ethernet PHYs in compliance with the IEEE 802.3cz standard. The standard defines robust multi-gigabit optical automotive Ethernet (2.5G–50G) over multimode fiber, delivering low-latency, EMI-immune links with high bandwidth and reduced cabling weight — forming the foundation for software-defined vehicles and advanced driver-assistance systems.
Read more: Optical Automotive Ethernet Transmitter Test Solution
31 October 2025 – ANRITSU has expanded its 5G NR NTN testing capabilities by adding 3GPP-compliant wireless test cases to the New Radio RF Conformance Test System ME7873NR. The 3GPP RAN5 Technical Working Group, which is responsible for 5G device test specifications, developed these test cases. Using the ME7873NR allows creation of an evaluation environment for 5G NR NTN devices.
30 October 2025 - Global testing and certification organization DEKRA and Sphere Energy, a pioneering innovator in leveraging artificial intelligence for battery development, have entered a strategic partnership whereby DEKRA has become a shareholder in Sphere. The goal of the partnership is to establish a new standard approach for testing and AI-based simulation and provide Europe’s leading battery testing and validation organization. The collaboration combines DEKRA’s long experience in the areas of testing, certification and homologation with Sphere Energy’s specialist cell expertise and proprietary AI-based simulation models.
29 October 2025 — Advantest America announced it is reinventing semiconductor testing with the power of real-time artificial intelligence (AI). Advantest is combining advanced machine learning (ML) from NVIDIA with the Advantest Cloud Solutions Real-Time Data Infrastructure (ACS RTDI) to drive a shift from traditional test workflows to adaptive AI-driven systems. NVIDIA has selected ACS RTDI for high-volume production to power its latest AI-enabled applications for Blackwell and next-generation devices —aiming to deliver breakthrough efficiency, reduced costs, and improved yields.
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