All-about-Test

1. Linking Inspection Data of AOI, SPI, and AXI Systems ...: (Board test); Linking Inspection Data of AOI, SPI, and AXI Systems 21 July 2015 - GOEPEL electronics launched PILOT Connect – a system for linking all test data of automatic optical, solder paste and X-ray inspection. ...; Created on 20 July 2015
2. Dual Mode SPI and AOI Inspection Platform ...: (Board test); Dual Mode SPI and AOI Inspection Platform 13 March 2014 ― ASC International released the new LineMaster DM platform. The new system incorporates SPI and AOI into one platform for “Dual Mode” performance. ...; Created on 13 March 2014
3. JUKI takes over Sony EMCS and enters AOI and SPI Market ...: (Board test); JUKI takes over Sony EMCS and enters AOI and SPI Market 03 February 2014 - JUKI Corporation and Sony EMCS Corporation, a subsidiary of Sony Corp. Japan, united their currently individually run businesses ...; Created on 03 February 2014
4. Agilent Technologies revealed the Name of its Electronic Measurement Spin-Off ...: (General T&M); Agilent Technologies revealed the Name of its Electronic Measurement Spin-Off 08 January 2014 – On Sept. 19, 2013, Agilent announced plans to separate into two publicly traded companies through a spinoff ...; Created on 08 January 2014
5. Viscom presents new Software Release for 3-D SPI, AOI and AXI Systems ...: (Board test); Viscom presents new Software Release for 3-D SPI, AOI and AXI Systems 25 June 2013 – With the Software Release SI 7.46 Viscom integrated many new functionalities that further increase the performance ...; Created on 25 June 2013
6. New eBook: Functional Tests on I2C and SPI Monitors with JTAG ...: (Board test); New eBook: Functional Tests on I2C and SPI Monitors with JTAG 13 May 2013 - A new eBook from ASSET InterTech explains how the structural test methodology based on the IEEE 1149.1 boundary scan standard, ...; Created on 13 May 2013
7. Corelis introduces High-Speed Quad-SPI Host Adapter ...: (Board test); Corelis introduces High-Speed Quad-SPI Host Adapter 08 August 2012 – Corelis announced the introduction of the BusPro-S, a high-speed multi-IO SPI host adapter. The BusPro-S USB-powered desktop ...; Created on 08 August 2012
8. SMT/Hybrid/Packaging 2012: MIRTEC to exhibit Innovative AOI and SPI Systems ...: (Board test); SMT/Hybrid/Packaging 2012: MIRTEC to exhibit Innovative AOI and SPI Systems 04 May 2012 – MIRTEC will showcase its award-winning MV-9 3D Series AOI System alongside a range of other AOI and SPI technologies ...; Created on 04 May 2012
9. MIRTEC: Extensive Range of AOI and SPI Systems ...: (Board test); MIRTEC: Extensive Range of AOI and SPI Systems 09 November 2011 – MIRTEC will present a comprehensive range of 3D AOI, SPI and LED technologies at their Booth # 377, Hall A2 at Productronica. Mirtec ...; Created on 09 November 2011
10. High-Resolution SPI for Printing and Dispensing Processes ...: (Board test); High-Resolution SPI for Printing and Dispensing Processes 31 May 2011 - Traqu is a high-resolution digital 3-D inspection device from Essemtec used for 3-D measurement and analysis in processes such ...; Created on 31 May 2011
11. TRI introduces new tiny ICT and fast SPI Solution ...: (Board test); TRI introduces new tiny ICT and fast SPI Solution 05 May 2011 – Test Research Inc. (TRI) introduced two new machines, TR5001T and TR7007. The TR5001T is a tiny in-circuit tester with high testing speeds ...; Created on 05 May 2011
12. Tool for AOI & SPI process improvement ...: (Board test); Tool for AOI & SPI process improvement 05 May 2011 - Process control and improvement requires detailed information about the total manufacturing process. Indentifying process issues at the earliest ...; Created on 05 May 2011
13. Rohde & Schwarz enters High-Performance Oscilloscope Market: (General T&M); ... MIPI, etc.), multichannel RF interfaces (radio or radar), DDR memory interfaces, complex power management units, and even simple control and programming buses (I2C, SPI, etc.). The R&S RTP can test all ...; Created on 11 June 2018
14. Improved inspection of Solder Pastes, Sinter Pastes and DCB Substrates: (Board test); Improved inspection of Solder Pastes, Sinter Pastes and DCB Substrates 08 June 2018 - GOEPEL electronic has upgraded the inline inspection system SPI Line · 3D. In addition to 3D solder paste inspection, ...; Created on 07 June 2018
15. Infrastructure for Deployed Systems Management: (General T&M); ... like the Industrial Internet of Things, 5G and the electrification of vehicles, coupled with existing realities like maintaining distributed legacy systems, are inspiring companies to seek new approaches ...; Created on 23 May 2018
16. Ultra-high Precision, self-contained Digitizers: (General T&M); ... oblem signals like glitches, spikes, bursts, or even when specific patterns occur, allows storing the recorded waveforms in the most memory efficient way possible. Transient capture, Multiple (burst) Reco ...; Created on 22 May 2018
17. Floating Power Source for Testing Power-Management-ICs: (Component Test); ... systems that operate with a traditional analog feedback. Digital feedback technology offers several unique features including spike-free “smart connections” with constant Kelvin monitoring for reliable ...; Created on 05 May 2018
18. Entry-level Spectrum Analyzer combines 3 RF Test Instruments: (General T&M); ... price tag. Despite its budget-friendly concept, the R&S FPC1500 is designed to the same quality standards as high-end Rohde & Schwarz instruments, providing solid RF performance and a comprehensive future-read ...; Created on 24 April 2018
19. Teledyne LeCroy launched new Oscilloscope Models: (General T&M); ... the 100-MHz 3014z, $4,190 for the 200-MHz 3024z, $6,500 for the 350-MHz 3043z, $8,450 for the 500-MHz 3054z, and $9,950 for the 1-GHz 3104z. Serial-data options, including CAN/LIN, CAN FD, I2C/SPI/UART/R ...; Created on 16 April 2018
20. Yamaha enters Solder Paste Inspection Market: (Board test); ... based on its “1-head solution” concept for using a single type of head to handle various inspections. The YSi-SP is Yamaha Motor’s first solder paste inspection (SPI) machine. It is used to inspect the ...; Created on 15 April 2018
21. Affordable Mixed Signal Oscilloscopes with 1 GSa/s Sampling Rate: (General T&M); ... 70, 100, 200, and 300MHz models 2 GSa/s sample rate interleaved 140 Mpts maximum record length 16 digital channels with logic analyzer (MSO upgrade) Serial bus decoding supporting I2C, SPI, UART/RS232, ...; Created on 03 April 2018
22. Compact low-cost eight-in-one Oscilloscope: (General T&M); ... four-channel pattern generator and a protocol analyzer for I2C, SPI, UART/RS-232, CAN and LIN; and as a digital voltmeter, component tester, spectrum analyzer and counter. With this eight-in-one instrument ...; Created on 12 March 2018
23. JTAG DFT Assistant for Zuken PCB Design Suite: (Board test); ... process before any hardware is produced, by reporting any potential design issues. Being able to validate the design early avoids board re-spins and costly delays to a project. XJTAG DFT Assistant helps ...; Created on 25 February 2018
24. AOI System with scalable Resolutions: (Board test); ... for accurate machine-2-machine (M2M) communication. Saki's CoaXPress interface in the overhead camera captures images 1.7 times faster than previous models. Also are Saki's 3D solder paste inspection (S ...; Created on 21 January 2018
25. Active Probe Solution for Emerging High-Speed Links: (Board test); ... that can power up to 10 probes simultaneously. Similarly, implementations of peripheral buses such as QSPI constantly push printed circuit board limits in terms of frequency, timing, and latency. Such ...; Created on 12 October 2017
26. High-Throughput 1 ns Pulsed IV Memory Test Solution: (Component Test); High-Throughput 1 ns Pulsed IV Memory Test Solution 11 October 2017 – Keysight Technologies announced a solution to characterize magnetic tunnel junction (MTJ) for spin transfer torque magnetoresistive ...; Created on 09 October 2017
27. RIGOL launched new 100/200 MHz Oscilloscopes: (General T&M); ... fidelity in this instrument class. From now until 3/31/2018 RIGOL will provide a free options upgrade with the purchase of any new DS2000E. This bundle includes all Serial Decode (RS232, I2C, SPI, CAN) ...; Created on 01 October 2017
28. High Speed and High Resolution Solder Paste Inspection System: (Board test); ... zero reference. The S2 moves SPI forwards from a means of Process control to one of Production control. Using the Mek S2 and the Real-Time feedback provided by the SPC-One SPC package the user can narrow ...; Created on 17 September 2017
29. Oscilloscope with integrated AWG and Pattern Generator: (General T&M); ... generate clock and bus signals such as SPI, for example. A typical application is measuring the settling time of power amplifiers after using a serial bus telegram to set the parameters. Users can operat ...; Created on 07 August 2017
30. USB-based 6 GHz Vector Network Analyzer: (General T&M); ... vector network analyzer of unprecedented performance, portability and affordability. Despite its small size and low cost, the instrument boasts a full-function, minimal-error, ‘Quad RX’ four-receiver architecture. ...; Created on 04 June 2017
31. Inspection of PCB-mounted Press-fit Connectors: (Board test); ... conventional connector pins on PCBs. Possible test functions are control of the x/y deflection and measurement of the pin height. Despite the increasing miniaturization and ever higher integration density ...; Created on 03 May 2017
32. Compact Power Supply with variable Channel Switching: (General T&M); ... as soon as one of the linked channels reaches a limit. Users can define a delayed response time to prevent the power supply from switching off in the event of a short current spike. Remote control for ...; Created on 02 May 2017
33. Mek (Marantz Electronics) expands its Sales Network in Western Europe: (Board test); Mek (Marantz Electronics) expands its Sales Network in Western Europe 25 April 2017 - AOI/SPI designer and manufacturer Mek (Marantz Electronics) announced the further expansion of its European sales ...; Created on 23 April 2017
34. Test and programming Solutions for embedded Electronics: (Board test); ... to integrate functional tests such as access to I²C and SPI modules, measurement and evaluation of analogue processor inputs, dynamic memory tests and even testing of high-speed interfaces such as USB ...; Created on 17 April 2017
35. GW Instek launches new Mixed-Signal Oscilloscope: (General T&M); ... and decoding functions include I2C, SPI, UART (RS232/422/485) and CAN/LIN bus for automotive communications. Serial bus waveforms can be triggered and decoded in real time. Via the waveform search function, ...; Created on 25 March 2017
36. Lock-in Amplifier with Tip-Protection: (General T&M); ... signals such as the demodulated signal and PID feedback signals into a digital state. A configurable low-pass filter helps to avoid false alarms due to short-lived signal loss or spikes. The digital ...; Created on 21 March 2017
37. XJTAG DFT for Mentor Graphics PADS: (Board test); ... design stage. Failure to identify and fix design errors at an early stage can result in a board re-spin and a costly delay to a project. XJTAG DFT Assistant helps validate correct JTAG chain connectivity, ...; Created on 19 March 2017
38. Ultra-Low Cost 50 to 100 MHz Oscilloscope Series: (General T&M); ... of popular embedded and automotive serial bus applications, which include I2C, SPI, UART/RS232, CAN and LIN. www.keysight.com/ ...; Created on 06 March 2017
39. Free CAN FD Decoder for PicoScope Oscilloscopes: (Board test); ... already decode a wide variety of serial protocols such as I2C, SPI and UART, as well as automotive standards such as CAN, LIN and FlexRay,” said Trevor Smith, Business Development Manager, Test & Measurement, ...; Created on 28 February 2017
40. Test Solution analyzes IP Security Mechanisms in IoT and Mobile Devices: (Board test); ... t function is the active scanning of the IP ports on the mobile or IoT device. This makes it easy to detect invalid configurations and suspicious communications behavior. Lab use with controlled wirele ...; Created on 28 February 2017
41. Test Solution for Remote Keyless Entry Systems: (Board test); ... RF bursts from UWB signals. The system also handles wireline DUT communications such as LIN, CAN, I2C and SPI. An R&S FPS spectrum analyzer evaluates RF signals in the frequency and time domain. A Helmholtz ...; Created on 29 November 2016
42. Central Verification of Inspection Results from Several Systems: (Board test); ... in the respective lines can be omitted. One highlight of the software package is the integration of inspection systems (AOI, AXI, SPI) from other manufacturers. This includes both error display and ...; Created on 23 November 2016
43. Test Probes for Signals up to 18 Gb/s: (General T&M); ... without breaking a budget. Despite their attractive specification they are cost‑effective in applications from as little as 500 MHz or 1 Gb/s. Pico offers probe division ratios of ÷5, ÷10 and ÷20 in ...; Created on 04 November 2016
44. NI Announces CEO Transition Plan: (General T&M); ... and NI have had on engineering and science over these last four decades. The innovation he has enabled across so many industries inspires me to this day. I look forward to his ongoing contributions as ...; Created on 10 October 2016
45. Zurich Instruments opens China Office: (General T&M); ... from a ETH Zurich spin-off to a global technology leader in the test & measurement business.“ www.zhinst.com/ ...; Created on 03 August 2016
46. Faster structural and functional Test on Prototype and Production Circuit Boards: (Board test); ... to train properly during system initialization, the system will simply disable the failing lane, but the bus will be reported as operational despite its significantly diminished throughput. ScanWorks PCT ...; Created on 18 July 2016
47. Eye Diagrams Capabilities for Serial Trigger and Decode Solutions: (General T&M); ... available. Eye Diagram is available for the following standards: I2C, SPI, UART RS-232, CAN, CAN FD, FlexRay, LIN, ARINC429, MIL-STD-1553, USB 2.0, 8b/10b, LPDDR2, DDR2, DDR3;, D-PHY/CSI-2/DSI, M-PHY, ...; Created on 28 June 2016
48. Off-line X-Ray System with higher Throughput: (Board test); ... Uplink, this MXI system can be coupled with the SPI, AOI or even AXI systems from Viscom. Defect detection and prevention see significant improvement with such linkage. Suspect inspection results from ...; Created on 05 May 2016
49. Cost-Efficient Testing of High-Volume, Cost-Sensitive Flash Memories: (Component Test); ... Advantest’s new tester is ideally suited for handling a wide range of devices including NOR and NAND flash memories that use the standard serial peripheral interface (SPI) protocol, low-pin-count flash ...; Created on 24 April 2016
50. Semiconductor Device Modeling and Characterization Software Tool Suite: (Component Test); ... , high-throughput device modeling, while MQA 2016 provides the complete solution and framework to fabless design companies, IDMs and foundries for SPICE model library validation, comparison and documentatio ...; Created on 04 April 2016

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