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News - Board and System Test
GOEPEL electronic doubles Inspection Speed of AOI System05 February 2014 - GOEPEL electronic increased the inspection speed of its high-end AOI system OptiCon TurboLine. Innovative solutions for optimizing image capturing technology and test program execution enable an inspection time reduction of up to 50% for heavy utilization of angled-view inspection. This significant performance increase is already implemented in customer systems, proven for assembly inspection in the production process.
JDSU acquires Trendium03 February 2014 – JDSU announced it has acquired substantially all of the assets of Trendium, a provider of real-time intelligence software solutions for customer experience assurance, asset optimization and monetization of big data for 4G/LTE mobile network operators. JUKI takes over Sony EMCS and enters AOI and SPI Market03 February 2014 - JUKI Corporation and Sony EMCS Corporation, a subsidiary of Sony Corp. Japan, united their currently individually run businesses in the range of assembly technology and related businesses under “JUKI Automation Systems Corporation”. With the integration of Sony EMCS newly developed AOI and SPI systems have been added to the JUKI portfolio. With these new systems JUKI introduces a complete process quality control for high performance lines as well as for high flex lines. Automated HDMI 2.0 Compliance Test and Debug Solution31 January 2014 - Tektronix announced a fully automated compliance test and debug solution for the recently released HDMI 2.0 specification. The solution covers the HDMI 2.0 transmitter tests and Direct Synthesis based receiver tests, and cable test requirements for fast, consistent and accurate test results. The successor to the widely adopted HDMI 1.4a/b standard, HDMI 2.0 is designed to meet the bandwidth requirements of forthcoming Ultra HD or 4K televisions while using existing cabling for backward compatibility. USB 3.0 SSIC and MIPI CSI-3 Protocol-Decoding Software for Oscilloscopes30 January 2014 – Agilent Technologies introduced the industry’s first software for decoding USB 3.0 SuperSpeed Inter-Chip (SSIC) and MIPI Camera Serial Interface 3 (CSI-3) protocols on oscilloscopes. The new protocol decoders provide design and validation engineers with a fast, easy way to validate and debug their SSIC and CSI-3 interfaces.
Boundary Scan Solution for Teradyne Board Tester30 January 2014 - GOEPEL electronic and Teradyne developed an extended Boundary Scan option particularly for production In-Circuit Test/Functional Board Test of PCBs and the modular functional testers on VXI and PXI Express basis. The solution is based on a pure software integration of the Boundary Scan platform SYSTEM as so called softpod, applying the tester’s native I/O instrumentation as JTAG hardware. Consequently, users benefit in several respects from a unified test setup, higher test coverage and reusability of Boundary Scan procedures throughout the entire product life cycle.
CyberOptics to acquire 3D Metrology Company27 January 2013 - CyberOptics announced it has entered into a definitive agreement to acquire the assets of Laser Design, Inc. (LDI), a 3D metrology company headquartered in Minneapolis. The approximately $3.0 million all-cash transaction is expected to close in February 2014, pending approval by LDI’s shareholders. LDI, which will be operated initially as a wholly-owned subsidiary, is forecasted to have a minimal impact on CyberOptics’ consolidated bottom line performance in 2014. More Articles ...
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