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News - Board and System TestNordson YESTECH upgrades AOI System and Software02 May 2011 – Nordson YESTECH presented the latest generation FX Series AOI and upgraded YESPC software. The FX Series AOI is equally well suited for high-volume or high mix manufacturing environments, providing fast throughput and high resolution for inspection of 01005 components. Nordson YESTECH’s Advanced Fusion Lighting and 5 megapixel color image processing technology provides complete inspection coverage with extremely low false failure rates. Test of High-Speed HSPA+ Wireless Devices29 April 2011 - Anritsu introduces a software option for its MD8480C W-CDMA/GSM Signaling Tester that enables testing for the latest W-CDMA/GSM devices supporting simultaneous 64QAM and MIMO. The MX848001E-17 Simultaneous 64QAM/MIMO option enables the MD8480C Signaling Tester to conduct protocol-based testing on new W-CDMA/GSM wireless devices that incorporate this feature. Communication Controller for MOST15028 April 2011 - GOEPEL electronic provides PXI 6161, an all-new communication controller supporting MOST150 based on the highly powerful Series 61. Using this new hardware platform, users are able to individually and flexibly configure the controller according to their individual needs. That means, GOEPEL electronic provides one-stop solutions in software and hardware supporting MOST150. High-performance 3D Void Inspection with inline X-Ray System20 April 2011 - GOEPEL electronics’ inline x-ray inspection system OptiCon X-Line 3D provides the powerful opportunity to detect voids with in various layers of large volume solder joints. In particular in the areas of power electronics for wind power, solar electricity or electro mobility the solder quality is highly important for the components’ thermal coupling, as high reliability and long service life must be guaranteed by maximum heat dissipation. New Method to measure Group Delay over long Distances19 April 2011 — Rohde & Schwarz has developed a unique method that accurately measures group delay and phase linearity on satellite links. With the new R&S ZVA-K10 software option, users can perform measurements using two network analyzers located at separate sites. In open-area tests, for example, the analyzers can bridge long distances between a transmitter and a receiver. Test Equipment for Sub-Assemblies of Electric Vehicles14 April 2011 - IPTE Factory Automation (FA) announces a test system for the battery charger block (BCB), a sub-assembly needed for the management of the charging procedure and the functional control of the storage-battery pack in electric vehicles (EV). The test system was developed in cooperation with a customer. Teradyne and JTAG Technologies announce Boundary Scan Product Collaboration14. April 2011 - Teradyne, Inc. announced an agreement with JTAG Technologies to sell and distribute their Symphony/TS boundary scan product. The solution, designed specifically for Teradyne by JTAG Technologies, provides an advanced boundary scan test option for manufacturers using Teradyne's popular TestStationT and legacy GR228X family of In-Circuit Test systems. More Articles ...
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