|
||||
News and Information about the Test of Electronics in Research & Design, Production, Maintenance, and Installation. | ||||
Main MenuNewsletterNews AreaInfo AreaWeblinksProduct Focus |
Readers Top 5 News of last 30 days
News - Board and System TestCompact Broadband Amplifier System for EMI Applications17 March 2011 — Rohde & Schwarz adds new functions to its R&S BBA100 broadband amplifier family to create a one-box solution. Integrated RF output switches and sample port switches allow the amplifiers to be used for many applications without the need for external switching matrices. Existing third-party amplifiers can also be integrated into the R&S BBA100 system. EMI Receiver with excellent Input Sensitivity16 March 2011 – Agilent Technologies Inc. announced the introduction of the N9038A MXE EMI receiver, which is designed for laboratories that perform compliance testing of electrical and electronic products. The MXE enhances electromagnetic interference (EMI) measurement accuracy and repeatability with a displayed average noise level (DANL) of -163 dBm at 1 GHz. This represents excellent input sensitivity, an essential receiver attribute that reduces the effects of electrical noise. BSDL Testbench for Multi Chip Modules and 3D Chips15 March 2011 - GOEPEL electronic announces the availability of a new option in its recently introduced EDA software TAPChecker. Multi-Chip Modules (MCM) and 3D chips are now supported, allowing testbench generation for VHDL, Verilog and STIL output formats. Users now have the opportunity to verify more complex designs with several Boundary Scan components or dies incl. interconnections by a comprehensive behaviour simulation. Aeroflex announces new Application for DMR Radio Protocol Testing14 March 2011 – Aeroflex announced the availability of a new PC-based application for sending and receiving Digital Mobile Radio (DMR) radio data, using the 3920 as the generator and receiver. With this application, it is now possible for engineers and technicians to capture data from DMR radios and repeaters and also transmit user-defined data over the air to dynamically analyze DMR radio messages and isolate transmission and receiver problems in DMR systems. Inline X-Ray Inspection of BGA Solder Joints10 March 2011 - GOEPEL electronic’s 3D x-ray inspection system OptiCon X-Line 3D enables a safe quality control of BGA solder joints in the inline production process of single-sided and double-sided equipped PCBs within one test run. After image capturing from different directions and succeeding reconstruction, OptiCon X-Line 3D provides the opportunity to analyse board top and bottom sides layer by layer. Test of standardized RJ plug connections08 March 2011 - ENGMATEC introduced special test plugs for RJ plug connections. The plugs have been designed specially for application with functional or in-circuit tests. RJ connections are modular plugs and sockets, which are used for telephone and network wiring worldwide. Validation Tools for Products with new 22nm Intel Core Processors07 March 2011 – ASSET is the first tools provider to launch third-party validation and debug tools for designs targeting the new 22nm "Ivy Bridge" Intel Core processors for the desktop and mobile marketplaces. The new processors will follow Intel’s recently released 2nd generation Intel Core processor products. Because of the higher speeds and complexities of these platforms, manufacturers will have greater requirements for validation and debug tools to ensure new products will be delivered to market in a timely manner. More Articles ...
Related Articles: |
Upcoming Events More events...
Tag CloudOscilloscope
JTAG
Boundary Scan
Goepel
PXI
Rohde & Schwarz
Tektronix
Keysight
AOI
Anritsu
National Instruments
Inspection
Teledyne LeCroy
Aeroflex
LTE
Yokogawa
AXI
Spectrum Analyzer
Keithley
In-Circuit-Test
Signal Analyzer
Automotive
EMC-Test
Signal Generator
Advantest
Multitest
B&K Precision
Corelis
Power Supply
SPI
Flying Prober
Teseq
Cognex
Switching
Teradyne
Viscom
Pickering
Fluke
GAO Tek
PCIe
|
||
© All about Test 2018 |