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Readers Top 5 News of last 30 days
News - Board and System TestNew Sales Partnership for the Polish Market16 February 2023 – With PB Technik Sp. z o.o. coming onboard, Viscom AG has gained a new strong distribution partner for Poland. The contract was signed on February 1, 2023 and covers Viscom's entire portfolio of inspection systems for electronics manufacturing. PB Technik is based in Warsaw, the capital of Poland. Founded in 1991, the company now represents many manufacturers known in the industry for equipping modern assembly lines and has over 40 employees, including its own service specialists. PCI Express 6.0 Electrical Testing15 February 2023 – Teledyne LeCroy announced support for PCI Express 6.0 electrical test and validation with QPHY-PCIE6-TX-RX fully automated test software, as well as SDAIII-PCIE6 and SDAIII-PAMx characterization and debug software packages. The growth of new technologies, including artificial intelligence/machine learning (AI/ML) and high-performance computing (HPC), are accelerating demand for fast access to large amounts of data. To support this growing demand, the next generation of PCI Express, PCIe 6.0 technology, will use multi-level signaling (PAM4) to double data transfer speeds from the 32 GT/s transfer speed provided by PCIe 5.0 technology. Debugging of High-end SoCs10. February 2023 - With its current version 2023 of the Universal Debug Engine (UDE), PLS Programmierbare Logik & Systeme offers system developers a whole range of completely new and further optimized functions for debugging and especially for runtime analysis of embedded software. The portfolio of supported high-end microcontrollers has also been greatly expanded. PLS will present UDE 2023 for the first time at embedded world 2023 in Nuremberg in Hall 4, Booth 4-310. Time-correlated USB4 Viewing and Analysis of Oscilloscope and Protocol Analyzer09 February 2023 – Teledyne LeCroy announced the extension of their patented CrossSync PHY technology to USB4 signaling over USB Type-C connectors. CrossSync PHY enables waveforms from Teledyne LeCroy oscilloscopes to be viewed alongside protocol analyzer traces, with complete time-correlation of electrical and protocol information for easy and powerful validation and root-cause analysis. Automated Test Tool for UWB PHY Layer Validation and Conformance Testing08 February 2023 - NI (National Instruments) announced validation by the FiRaTM Consortium of its UWB PHY test solution. NI’s solution can now be used by device manufacturers and chip designers to automatically test the conformance of their Ultra-Wideband (UWB) enabled products against version 1.3 of FiRa’s PHY specifications. Signal Integrity Simulation Software02 February 2023 - Keysight Technologies introduced the Electrical Performance Scan (EP-Scan), a new high-speed digital simulation tool that supports rapid signal integrity (SI) analysis for hardware engineers and printed circuit board (PCB) designers. EP-Scan provides electrical performance insights that enable high-speed digital designers to perform quick diagnostics and remove the verification bottleneck. It identifies layout issues quickly, catches design inconsistencies early, and creates design progress reports effortlessly. 800 Gigabit Ethernet, 8 Lane PAM4 Protocol Test Solution31 January 2023 – Teledyne LeCroy announced the SierraNet M1288 Protocol Test Solution, which supports analysis of up to 8 lanes of IEEE 802.3ck based Ethernet traffic and 112GbE four-level Pulse Amplitude Modulation (PAM4). Doubling the speeds of previous ethernet protocol testing solutions, the M1288 enables troubleshooting from the physical layer through the application layer for up to 800 Gigabit Ethernet traffic. More Articles ...
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