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Latest Test and Measurement NewsIn-System Emulation Technology for ARM11 Cores19 August 2010 - GOEPEL electronic has developed a dedicated model library for processors with ARM11 architecture that supports the emulation technology VarioTAP. The libraries are structured modularly as intelligent IP and enable a complete fusion of Boundary Scan test and JTAG emulation. Employing this technology, embedded or external Flash can be in-system programmed via the native processor function. Furthermore, VarioTAP supports interlaced Bus Emulation Tests (BET) and System Emulation Tests (SET) for extended JTAG/Boundary Scan functionality. Automated Test Routine for Validating MIPI D-PHY Designs17 August 2010 – Tektronix, Inc. expanded its support for MIPI® (Mobile Industry Processor Interface) Standards with the release of Option D-PHYTX on the TekExpress platform which offers the industry’s first simplified one-button solution for the latest D-PHY specification across a preliminary set of measurements. Analysis and Processing of ATML Test Results13 August 2010 - Diagnosys expands its PinPoint Test Result Server (TRS) solution to include the analysis and processing of ATML (Automatic Test Markup Language) Test Results indictments. ATML is an XML-based (extensible markup language) standard for ATE (Automatic Test Equipment) and test information data exchange defined by a collection of XML schemas to represent test information, such as test programs, test asset interoperability, and UUT (unit under test) test data including test results and diagnostics procedures. Nordson Enhances Electronic Test and Inspection Capabilities13 August 2010 - Nordson Corporation announced that it has formed a test and inspection group within its Advanced Technology segment to better leverage the competencies of its Nordson DAGE and Nordson YESTECH subsidiaries. The new group combines the expertise of Nordson DAGE, the industry leader in bond testing and X-ray inspection technology, and Nordson YESTECH, the leader in automated optical inspection (AOI). Shorten Time to Market with Faster Test Bench Development12 August 2010 – Mentor Graphics Corporation announced that collaborative efforts with National Instruments have resulted in a solution that provides test-oriented feedback to design teams at every step of the design process. The new SystemVision™ SVX Client environment for the NI LabVIEW software allows designers to develop their test bench against a virtual prototype based upon their specification, and then use the exact same test bench in the NI LabVIEW software on physical prototypes. Aeroflex supports 3GPP WCDMA Release 912 August 2010 — Aeroflex announced that its Infrastructure test system TM500 Test Mobile has added support for the 3GPP WCDMA Release 9 standard, the latest evolution of the HSPA+ standards, which permits concurrent operation of MIMO (Multiple-Input, Multiple-Output) and DC-HSDPA (Dual Cell High-Speed Download Packet Access). This doubles the maximum data rate to 84 Mbps. Tektronix Commits to 200 GHz SiGe Technology11 August 2010 – Tektronix, Inc. announced that its next-generation, scalable, performance oscilloscope platform will make broad use of IBM 8HP silicon germanium (SiGe) technology. The 130 nanometer (nm) SiGe bipolar complementary metal oxide semiconductor (BiCMOS) foundry technology offers 2x performance over the previous generation — and targets delivery of oscilloscopes with real-time bandwidth beyond 30 GHz. More Articles ...
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